Improving surface passivation on very thin substrates for high efficiency silicon heterojunction solar cells von Balaji, Pradeep, Dauksher, William J., Bowden, Stuart G., Augusto, André

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ITO/SiOx:H stacks for silicon heterojunction solar cells von Herasimenka, Stanislau Y, Dauksher, William J, Boccard, Mathieu, Bowden, Stuart

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Manipulation of K center charge states in silicon nitride films to achieve excellent surface passivation for silicon solar cells von Sharma, Vivek, Tracy, Clarence, Schroder, Dieter, Herasimenka, Stanislau, Dauksher, William, Bowden, Stuart

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Surface passivation of n-type c-Si wafers by a-Si/SiO2/SiNx stack with <1 cm/s effective surface recombination velocity von Herasimenka, Stanislau Y., Tracy, Clarence J., Sharma, Vivek, Vulic, Natasa, Dauksher, William J., Bowden, Stuart G.

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750 mV open circuit voltage measured on 50 μ m thick silicon heterojunction solar cell von Herasimenka, Stanislau Y., Dauksher, William J., Bowden, Stuart G.

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Publisher's Note: “Surface passivation of n-type c-Si wafers by a-Si/SiO2/SiNx stack with <1 cm/s effective surface recombination velocity” [Appl. Phys. Lett. 103, 183903 (2013)]... von Herasimenka, Stanislau Y., Tracy, Clarence J., Sharma, Vivek, Vulic, Natasa, Dauksher, William J., Bowden, Stuart G.

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Distortion and overlay performance of UV step and repeat imprint lithography von Choi, Jin, Nordquist, Kevin, Cherala, Ashuman, Casoose, Lester, Gehoski, Kathy, Dauksher, William J., Sreenivasan, S.V., Resnick, Douglas J.

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Model for a multiple-step deep Si etch process von Rauf, Shahid, Dauksher, William J., Clemens, Stephen B., Smith, Kenneth H.

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Damage-free laser patterning of silicon nitride on textured crystalline silicon using an amorphous silicon etch mask for Ni/Cu plated silicon solar cells von Bailly, Mark S., Karas, Joseph, Jain, Harsh, Dauksher, William J., Bowden, Stuart

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Direct pattern transfer for sub-45 nm features using nanoimprint lithography von Le, Ngoc V., Dauksher, William J., Gehoski, Kathy A., Nordquist, Kevin J., Ainley, Eric, Mangat, Pawitter

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Selective dry etch process for step and flash imprint lithography von Le, Ngoc V., Dauksher, William J., Gehoski, Kathy A., Resnick, Douglas J., Hooper, A.E., Johnson, Steve, Willson, Grant

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Direct pattern transfer for sub-45nm features using nanoimprint lithography von Le, Ngoc V., Dauksher, William J., Gehoski, Kathy A., Nordquist, Kevin J., Ainley, Eric, Mangat, Pawitter

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Fabrication of step and flash imprint lithography templates using a variable shaped-beam exposure tool von Dauksher, William J., Mancini, David, Nordquist, Kevin, Resnick, Douglas J., Hudek, Peter, Beyer, Dirk, Groves, Tim, Fortagne, Olaf

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Critical Dimension Issues for 200 mm Electron Projection Masks von Resnick, Douglas J., Nordquist, Kevin, Dauksher, William J., Ainley, Eric, Lu, Bing, Mangat, Pawitter, Weisbrod, Eric, Martin, Carl, Chang, J., Englestad, Roxann, Lovell, Ed, Ivin, Vladimir

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Inspection of templates for imprint lithography von Hess, Harald F., Pettibone, Don, Adler, David, Bertsche, Kirk, Nordquist, Kevin J., Mancini, David P., Dauksher, William J., Resnick, Douglas J.

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METHOD FOR HIGH VOLUME MANUFACTURING OF THIN FILM BATTERIES von EISENBEISER, Kurt, KRISHNA, Nety, DAUKSHER, William J, CANDELARIA, Jon, KWAK, Byung-sung

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METHOD OF FORMING LITHOGRAPHIC TEMPLATE AND USE OF IT von MANCINI, DAVID, P, RESNICK, DOUG, J, DAUKSHER, WILLIAM, J

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Plasma Etch Process for Multilayer Copper Interconnect Vias Having an Organic Layer with Vertical Sidewalls von Weston, Donald, Dauksher, William, Le, Ngoc

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Plasma Etch Process for Defining Patterns in Catalyst Metals Prior to Nanotube Growth von Weston, Donald, Dauksher, William, Howard, Emmett, Zhang, Ruth

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METHOD FOR HIGH VOLUME MANUFACTURING OF THIN FILM BATTERIES von KRISHNA, NETY, DAUKSHER, WILLIAM J, CANDELARIA, JON, KWAK, BYUNG-SUNG, EISENBEISER, KURT

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