Further Studies on the Effect of SiNx Refractive Index and Emitter Sheet Resistance on Potential-Induced Degradation von Jaewon Oh, Dauksher, Bill, Bowden, Stuart, Tamizhmani, Govindasamy, Hacke, Peter, D'Amico, John

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Characterization and comparison of silicon nitride films deposited using two novel processes von Sharma, Vivek, Bailey, Adam, Dauksher, Bill, Tracy, Clarence, Bowden, Stuart, O’Brien, Barry

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A novel low-temperature method to fabricate MEMS resonators using PMGI as a sacrificial layer von Young, Steven, Weston, Don, Dauksher, Bill, Mancini, David, Pacheco, Sergio, Zurcher, Peter, Miller, Mel

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Characterization and comparison of silicon nitride films deposited using two novel processes von Sharma, V., Bailey, A., Dauksher, B., Tracy, C., Bowden, S., O'Brien, B.

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Determination of charged state density at the interface between amorphous silicon and crystalline silicon by lateral conductance von Ghosh, Kunal, Tracy, Clarence J, Dauksher, Bill, Herasimenka, Stanislau, Honsberg, Christiana, Bowden, Stuart

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Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg) von Lau, John, Gleason, Jerry, Schroeder, Valeska, Henshall, Gregory, Dauksher, Walter, Sullivan, Bob

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Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg) von Lau, John, Gleason, Jerry, Schroeder, Valeska, Henshall, Gregory, Dauksher, Walter, Sullivan, Bob

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Design, materials and process for lead-free assembly of high-density packages von Smetana, Joe, Horsley, Rob, Lau, John, Snowdon, Ken, Shangguan, Dongkai, Gleason, Jerry, Memis, Irv, Love, Dave, Dauksher, Walter, Sullivan, Bob

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Towards a quantification of thermal and thermomechanical stress for modules in building‐integrated photovoltaics configurations von Quest, Hugo, Fairbrother, Andrew, Ballif, Christophe, Virtuani, Alessandro

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Low‐refractive‐index nanoparticle interlayers to reduce parasitic absorption in metallic rear reflectors of solar cells von Boccard, Mathieu, Firth, Peter, Yu, Zhengshan J., Fisher, Kathryn C., Leilaeioun, Mehdi, Manzoor, Salman, Holman, Zachary C.

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Polydimethylglutarimide (PMGI) as a sacrificial material for SU-8 surface-micromachining von Foulds, I G, Johnstone, R W, Parameswaran, M

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Use of reflective and amorphous materials for dark field stepper alignment on silicon carbide substrates von Mancini, David P., Resnick, Douglas J., Tompkins, Harland, Moore, Karen E.

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Coast‐to‐Coast Advocacy for Agriculture Research

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Release layers for contact and imprint lithography von Resnick, Douglas J, Mancini, David P, Sreenivasan, S V, C Grant Willson

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