Integrated Optical Carrier for Optical/Electrical Interconnect von Lim Teck Guan, Khoo Yee Mong, Yoon, Joey Chai Yi, Liang, Calivn Teo Wei, Yi, Germaine Hoe Yen, Yap Guan Jie, Ramana, P V, Tan Chee Wei, Damaruganath, P

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Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer von Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y

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Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material von Rao, V. S., Sekhar, V. N., Ho Soon Wee, Rajoo, R., Sharma, G., Lim Ying Ying, Damaruganath, P.

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Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP) von Lim Ying Ying, Wee, D. H. S., Kim Hyoung Joon, Damaruganath, P.

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A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach Networks von Chandrappan, J, Zhang Jing, Ng Rui Jie, Damaruganath, P, Lau, J

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Development of Via in Mold (ViM) for embedded wafer level package (EWMLP) von Soon Wee Ho, Myo Ei Pa Pa, Daniel, F. M., Wen Sheng Lee, Ser Choong Chong, Hyoung Joon Kim, Damaruganath, P., Gao Shan

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Study of high speed interconnects of multiple dies stack structure with Through-Silicon-Via (TSV) von Zhang Wenle, Khoo Yee Mong, Lim Teck Guan, Damaruganath, P, Teo Keng Hwa, Zhang Xiaowu

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Thermal and Hydraulic Design and Characterization of a Liquid-Cooled 3D Silicon Module von Tan, S.P., Toh, K.C., Khan, N., Tang Gong Yue, Damaruganath, P., Vaidyanathan, K., Lau, J.H.

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Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System' von Ser Choong Chong, Ling Xie, Yobas, L., Hong Miao Ji, Jing Li, Yu Chen, Damaruganath, P., Wing Cheong Hui, Iyer, M.K.

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Low cost 4-channel CWDM splitter using SiOB packaging von Li, J., Goh, J.K.H., Lee, B.S.P., Zhang, Q.X., Ramana, P.V., Damaruganath Pinjala

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Demonstration of Direct Coupled Optical/Electrical Circuit Board von Teck Guan Lim, Ramana, P.V., Lee, B.S.P., Shioda, T., Kuruveettil, H., Jing Li, Suzuki, K., Fujita, K., Yamada, K., Pinjala, D., Shing, J.L.H.

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