Global methodology for damage detection and localization in civil engineering structures von Frigui, F., Faye, J.P., Martin, C., Dalverny, O., Peres, F., Judenherc, S.

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Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling von Libot, J.B., Alexis, J., Dalverny, O., Arnaud, L., Milesi, P., Dulondel, F.

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2D and 3D numerical models of metal cutting with damage effects von Pantalé, O., Bacaria, J.-L., Dalverny, O., Rakotomalala, R., Caperaa, S.

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Study of image characteristics on digital image correlation error assessment von Fazzini, M., Mistou, S., Dalverny, O., Robert, L.

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Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications von Msolli, S., Alexis, J., Dalverny, O., Karama, M.

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Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements von Libot, J.-B, Alexis, J, Dalverny, O, Arnaud, L, Milesi, P, Dulondel, F

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Contribution for analyzing the intra-ply yarn sliding mechanism in preforming of the woven fabric von Labanieh, A. R., Garnier, C., Ouagne, P., Dalverny, O., Soulat, D.

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Reliability of lead-free solder in power module with stochastic uncertainty von Micol, A., Martin, C., Dalverny, O., Mermet-Guyennet, M., Karama, M.

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Electrical and mechanical characterisation of Si/Al ohmic contacts on diamond von CIVRAC, G, MSOLLI, S, ALEXIS, J, DALVERNY, O, SCHNEIDER, H

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Identification of Materials Properties Using Displacement Field Measurement von Dalverny, Olivier, Mistou, Sébastien, Fazzini, Marina

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Hybrid approach for woven fabric modelling based on discrete hypoelastic behaviour and experimental validation von Nasri, M., Garnier, C., Abbassi, F., Labanieh, A.R., Dalverny, O., Zghal, A.

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An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications von Micol, A., Zeanh, A., Lhommeau, T., Azzopardi, S., Woirgard, E., Dalverny, O., Karama, M.

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Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes von Dalverny, O., Alexis, J.

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Error assessment in Image Stereo-correlation von Brémand, Fabrice, Fazzini, M., Mistou, S., Dalverny, O.

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Assessment of candidate metallization systems deposited on diamond using nano-indentation and nano-scratching tests von Msolli, S., Alexis, J., Kim, H.S., Dalverny, O., Karama, M.

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Verification of a spherical plain bearing finite-element model using scattered light photoelasticity tests von Germaneau, A, Peyruseigt, F, Mistou, S, Dalverny, O, Doumalin, P, Dupré, J-C

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Numerical simulation of interfacial delamination between SiO2 thin film and polymeric substrate von Dalverny, O., Tongne, A., Ho, C., Alexis, J., Châtel, S., Faure, B.

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Experimental characterization and damage identification of polymeric film constituting stratospheric super pressurized balloons von Chaabane, M, Dalverny, O, Mistou, S, Alexis, J, Deramecourt, A

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Mechanical adhesion of SiO 2 thin films onto polymeric substrates von Ho, C., Alexis, J., Dalverny, O., Balcaen, Y., Dehoux, A., Châtel, S., Faure, B.

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Mechanical adhesion of SiO2 thin films onto polymeric substrates von Ho, C., Alexis, J., Dalverny, O., Balcaen, Y., Dehoux, A., Châtel, S., Faure, B.

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