Efficient resource management with reduced overhead information von Shin Jae Kang, Yun-Jae Won, Dai-Gil Kwon, Kyeung-Hak Seo, Seung-Ok Lim, van der Schaar, Mihaela

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Measurement of the degree of cure of glass fiber–epoxy composites using dielectrometry von Bang, Kyung Geun, Kwon, Jae Wook, Lee, Dai Gil, Lee, Jae Won

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Repair of underground buried pipes with resin transfer molding von Lee, Dai Gil, Chin, Woo Seok, Kwon, Jae Wook, Yoo, Ae Kwon

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Trenchless Repairing of Underground Pipes Using RTM Based on the Axiomatic Design Method von Chin, Woo Seok, Kwon, Jae Wook, Lee, Dai Gil

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신소재 복합재료를 이용한 비굴착 지하매설관 보수 - 보강공법 von 진우석, Woo Seok Chin, 권재욱, Jae Wook Kwon, 이대길, Dai Gil Lee, 유애권, Ae Kwon Yoo

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Hygrothermal effects on the strength of adhesively bonded joints von Lee, D G, Kwon, J W, Cho, D H

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC MATERIALS von KIM, BYUNGUL, LEE, SEUNG-MIN, CHIN, WOO-SEOK, KWON, JAE-WOOK, HWANG, HUI-YUN, LEE, DAI-GIL

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS von KIM, BYUNGUL, LEE, SEUNG-MIN, CHIN, WOO-SEOK, KWON, JAE-WOOK, HWANG, HUI-YUN, LEE, DAI-GIL

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Reinforcing element of underground pipe, and trenchless repairing and reinforcing method using the same von YOO AE KWON, KWON JAE WOOK, LEE DAI GIL, CHIN WOO SEOK

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Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials von HWANG HUI-YUN, YOON SOON-HO, KIM BYUNGUL, LEE DAI-GIL, LEE SEUNG-MIN, CHIN WOO-SEOK, KWON JAE-WOOK

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Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials von Lee, Dai-Gil, Hwang, Hui-Yun, Chin, Woo-Seok, Lee, Seung-Min, Kim, Byung-Chul, Kwon, Jae-Wook, Yoon, Soon-Ho

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC MATERIALS von KIM, BYUNGUL, CHIN, WOO-SEOK, KWON, JAE-WOOK, HWANG, HUI-YUN, LEE, DAI-GIL, LEE, SEUNG-MIN HA

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REINFORCING ELEMENT OF UNDERGROUND PIPE, AND TRENCHLESS REPAIRING AND REINFORCING METHOD USING THE SAME von CHIN, WOO, SEOK, YOO, AE, KWON, LEE, DAI, GIL, KWON, JAE, WOOK

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Method of repairing or reinforcing worn-out underground burried drainpipes by resin transfer molding process using both flexible tubes and bagging films von KWON JAE WOOK, YOO AE KWON, LEE DAI GIL, CHIN WOO SEOK

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Method of repairing or reinforcing worn-out underground burried drainpipes by resin transfer molding process using both flexible tubes and bagging films von Lee, Dai Gil, Kwon, Jae Wook, Chin, Woo Seok, Yoo, Ae Kwon

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Method of repairing or reinforcing worn-out underground burried drainpipes by resin transfer molding process using both flexible tubes and bagging films von KWON JAE WOOK, YOO AE KWON, LEE DAI GIL, CHIN WOO SEOK

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS von KIM, BYUNGUL, LEE, SEUNG-MIN, CHIN, WOO-SEOK, KWON, JAE-WOOK, HWANG, HUI-YUN, LEE, DAI-GIL

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS von CHIN, WOO SEOK, LEE, SEUNG MIN, KIM, BYUNG CHUL, KWON, JAE WOOK, HWANG, HUI YUN, LEE, DAI GIL

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS von HWANG HUI-YUN, YOON SOON-HO, KIM BYUNGUL, LEE DAI-GIL, LEE SEUNG-MIN, CHIN WOO-SEOK, KWON JAE-WOOK

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NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURE USING PIEZOELECTRICITIC CHARACTERISTICS OF ADHESIVE MATERIAL von CHIN, WOO SEOK, LEE, SEUNG MIN, KIM, BYUNG CHUL, KWON, JAE WOOK, HWANG, HUI YUN, LEE, DAI GIL

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