175 A Pilot Study of 360-Degree Perceptions of Emergency Physicians' Professionalism von Narajeenron, K., Velarde, I., Dukovic, J., Anderson, C.L., Chakravarthy, B., Hoonpongsimanont, W.

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The influence of lithographic patterning on current distribution : a model for microfabrication by electrodeposition von MEHDIZADEH, S, DUKOVIC, J. O, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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The influence of attached bubbles on potential drop and current distribution at gas-evolving electrodes von DUKOVIC, J, TOBIAS, C. W

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Electrochemical fabrication of mechanically robust PbSn C4 interconnections von DATTA, M, SHENOY, R. V, AGARWALA, B, TONG, H. M, TOTTA, P, JAHNES, C, ANDRICACOS, P. C, HORKANS, J, DUKOVIC, J. O, ROMANKIW, L. T, ROEDER, J, DELIGIANNI, H, NYE, H

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The influence of lithographic patterning on current distribution in electrodeposition : experimental study and mass-transfer effects von MEHDIZADEH, S, DUKOVIC, J, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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Pit growth in NiFe thin films von FRANKEL, G. S, DUKOVIC, J. O, BRUSIC, V, RUSH, B. M, JAHNES, C. V

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Optimization of electrodeposit uniformity by the use of auxiliary electrodes von MEHDIZADEH, S, DUKOVIC, J, ANDRICACOS, P. C, ROMANKIW, L. T, CHEH, H. Y

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Simulation of leveling in electrodeposition von DUKOVIC, J. O, TOBIAS, C. W

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Through-silicon-via technology for 3D integration von Dukovic, J, Ramaswami, S, Pamarthy, S, Yalamanchili, R, Rajagopalan, N, Sapre, K, Cao, Z, Ritzdorf, T, Wang, Y, Eaton, B, Ding, R, Hernandez, M, Naik, M, Mao, D, Tseng, J, Cui, D, Mori, G, Fulmer, P, Sirajuddin, K, Hua, J, Xia, S, Erickson, D, Beica, R, Young, E, Kusler, P, Kulzer, R, Oemardani, S, Dai, H, Xu, X, Okazaki, M, Dotan, K, Yu, C, Lazik, C, Tran, J, Luo, L

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Morphology of Electrodeposited Cu on 300 mm PEALD Ru Substrates von Kelly, James, Vo, Tuan, Van der Straten, O., Huang, Qiang, Baker O'Neal, Brett, Shao, X I., Chiang, Sunny, Dukovic, John

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Electrodeposition of Nickel‐Iron Alloys: I . Effect of Agitation von Andricacos, P. C., Arana, C., Tabib, J., Dukovic, J., Romankiw, L. T.

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Process Integration Considerations for 300 mm TSV Manufacturing von Ramaswami, S., Dukovic, J., Eaton, B., Pamarthy, S., Bhatnagar, A., Zhitao Cao, Sapre, K., Yuchun Wang, Kumar, A.

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The influence of lithographic pattering on current distribution in electrodeposition: experimental study and mass-transfer effects von Mehdizadeh, S, Dukovic, J, Andricacos, P C, Romankiw, L T, Cheh, H Y

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Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation von Kumar, N., Ramaswami, S., Dukovic, J., Tseng, J., Ran Ding, Rajagopalan, N., Eaton, B., Mishra, R., Yalamanchili, R., Zhihong Wang, Xia, S., Sapre, K., Hua, J., Chan, A., Mori, G., Linke, B.

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Advanced Waveform and Uniformity Control in the Initial Stage of Copper Electrodeposition von Hafezi, H., Behnke, Joseph, Dukovic, J., Rosenfeld, Aron

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Light-driven dinitrogen reduction catalyzed by a CdS:nitrogenase MoFe protein biohybrid von Brown, Katherine A., Harris, Derek F., Wilker, Molly B., Rasmussen, Andrew, Khadka, Nimesh, Hamby, Hayden, Keable, Stephen, Dukovic, Gordana, Peters, John W., Seefeldt, Lance C., King, Paul W.

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Oral teriflunomide for patients with relapsing multiple sclerosis (TOWER): a randomised, double-blind, placebo-controlled, phase 3 trial von Confavreux, Christian, Prof, O'Connor, Paul, Prof, Comi, Giancarlo, Prof, Freedman, Mark S, Prof, Miller, Aaron E, Prof, Olsson, Tomas P, Prof, Wolinsky, Jerry S, Prof, Bagulho, Teresa, MD, Delhay, Jean-Luc, MD, Dukovic, Deborah, MS, Truffinet, Philippe, MD, Kappos, Ludwig, Prof

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Hot topics in electroposition von GEWIRTH, A. A, ANDRICACOS, P. C, SWITZER, J. A, DUKOVIC, W. J. O

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Damascene copper electroplating for chip interconnections von ANDRICACOS, P. C, UZOH, C, DUKOVIC, J. O, HORKANS, J, DELIGIANNI, H

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Leukocyte count as an independent predictor of recurrent ischemic events von GRAU, Armin J, BODDY, Alexander W, DUKOVIC, Deborah A, BUGGLE, Florian, LICHY, Christoph, BRANDT, Tobias, HACKE, Werner

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