Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications von Duixian Liu, Xiaoxiong Gu, Baks, Christian W., Valdes-Garcia, Alberto

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Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications von Zhang, Y.P., Duixian Liu

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Integration of Array Antennas in Chip Package for 60-GHz Radios von Liu, Duixian, Zhang, Y. P.

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2020 John Kraus Antenna Award von Zhang, Yueping, Liu, Duixian

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A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications von Sadhu, Bodhisatwa, Tousi, Yahya, Hallin, Joakim, Sahl, Stefan, Reynolds, Scott K., Renstrom, Orjan, Sjogren, Kristoffer, Haapalahti, Olov, Mazor, Nadav, Bokinge, Bo, Weibull, Gustaf, Bengtsson, Hakan, Carlinger, Anders, Westesson, Eric, Thillberg, Jan-Erik, Rexberg, Leonard, Yeck, Mark, Xiaoxiong Gu, Ferriss, Mark, Duixian Liu, Friedman, Daniel, Valdes-Garcia, Alberto

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Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond von Gu, Xiaoxiong, Liu, Duixian, Sadhu, Bodhisatwa

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Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits von Liu, Duixian, Gaucher, Brian, Grzyb, Janusz, Pfeiffer, Ulrich

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Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications von Gu, Xiaoxiong, Liu, Duixian, Baks, Christian, Tageman, Ola, Sadhu, Bodhisatwa, Hallin, Joakim, Rexberg, Leonard, Parida, Pritish, Kwark, Young, Valdes-Garcia, Alberto

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Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios von Zhang, Y.P., Sun, M., Chua, K.M., Wai, L.L., Duixian Liu

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A 24-30-GHz 256-Element Dual-Polarized 5G Phased Array Using Fast On-Chip Beam Calculators and Magnetoelectric Dipole Antennas von Sadhu, Bodhisatwa, Paidimarri, Arun, Liu, Duixian, Yeck, Mark, Ozdag, Caglar, Tojo, Yujiro, Lee, Wooram, Gu, Kevin Xiaoxiong, Plouchart, Jean-Olivier, Baks, Christian W., Uemichi, Yusuke, Chakraborty, Sudipto, Yamaguchi, Yo, Guan, Ning, Valdes-Garcia, Alberto

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Study of Antenna Superstrates Using Metamaterials for Directivity Enhancement Based on Fabry-Perot Resonant Cavity von Li, Long, Shi, Xiao Wei, Lei, Shuo, Liu, Haixia

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A chip-scale packaging technology for 60-GHz wireless chipsets von Pfeiffer, U.R., Grzyb, J., Duixian Liu, Gaucher, B., Beukema, T., Floyd, B.A., Reynolds, S.K.

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Antenna-in-Package Integration for a Wideband Scalable 5G Millimeter-Wave Phased-Array Module von Gu, Xiaoxiong, Liu, Duixian, Hasegawa, Yuta, Masuko, Koichiro, Baks, Christian, Suto, Yuki, Fujisaku, Yoshiharu, Sadhu, Bodhisatwa, Paidimarri, Arun, Guan, Ning, Valdes-Garcia, Alberto

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What will 5G Antennas and Propagation Be? von Liu, Duixian, Hong, Wonbin, Rappaport, Theodore S., Luxey, Cyril, Hong, Wei

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A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications von Valdes-Garcia, Alberto, Floyd, Brian, Nicolson, Sean T., Lai, Jie-Wei, Natarajan, Arun, Chen, Ping-Yu, Reynolds, Scott K., Zhan, Jing-Hong Conan, Kam, Dong G., Liu, Duixian

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An improved predictive model for local deformational behavior of sandwich panels with gradient metallic foam cores von Mu, Lin, Lian, Qiuqi, Yang, Xiaofeng, Kou, Jialiang, Gao, Duixian

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A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications von Natarajan, A, Reynolds, S K, Ming-Da Tsai, Nicolson, S T, Zhan, J.-H C, Dong Gun Kam, Duixian Liu, Huang, Y.-L O, Valdes-Garcia, A, Floyd, B A

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Improving the Body Area Line-of-Sight Density Model : A Theoretical Study von Yang, Xiaodong, Zhang, Zhi-Ya, Yang, Shuyuan, Abbasi, Qammer Hussain, Zhao, Wei

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Miniaturized Circularly Polarized Microstrip RFID Antenna Using Fractal Metamaterial von Liu, Guo, Xu, Liang, Wu, Zhensen

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LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications von Dong Gun Kam, Duixian Liu, Natarajan, A, Reynolds, S, Ho-Chung Chen, Floyd, B A

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