Influence of phonon, geometry, impurity, and grain size on Copper line resistivity von Plombon, J. J., Andideh, Ebrahim, Dubin, Valery M., Maiz, Jose

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High-frequency electrical properties of individual and bundled carbon nanotubes von Plombon, J. J., O’Brien, Kevin P., Gstrein, Florian, Dubin, Valery M., Jiao, Yang

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Effects of local Joule heating on the reduction of contact resistance between carbon nanotubes and metal electrodes von Dong, Lifeng, Youkey, Steven, Bush, Jocelyn, Jiao, Jun, Dubin, Valery M., Chebiam, Ramanan V.

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Floating-Potential Dielectrophoresis-Controlled Fabrication of Single-Carbon-Nanotube Transistors and Their Electrical Properties von Dong, Lifeng, Chirayos, Vachara, Bush, Jocelyn, Jiao, Jun, Dubin, Valery M, Chebian, Ramanan V, Ono, Yoshi, Conley, John F, Ulrich, Bruce D

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Microstructure and reliability of copper interconnects von Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Haebum Lee, Nogami, T., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.

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Electrochemical aspects of new materials and technologies in microelectronics von Dubin, Valery M.

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Electroless copper deposition for ULSI von Shacham-Diamand, Yosi, Dubin, Valery, Angyal, Matthew

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Selective electroless Ni-Cu(P) deposition for via hole filling and conductor pattern cladding in VLSI multilevel interconnection structures von DUBIN, V. M

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Selective and blanket electroless copper deposition for ultralarge scale integration von DUBIN, V. M, SHACHAM-DIAMAND, Y, ZHAO, B, VASUDEV, P. K, TING, C. H

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Influence of phonon, geometry, impurity, and grain size on Copperline resistivity von Plombon, J. J., Andideh, Ebrahim, Dubin, Valery M., Maiz, Jose

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Formation mechanism of porous silicon layers obtained by anodization of monocrystalline n-type silicon in HF solutions von Dubin, Valery M.

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High-frequency electrical properties of individual and bundledcarbon nanotubes von Plombon, J. J., O'Brien, Kevin P., Gstrein, Florian, Dubin, Valery M., Jiao, Yang

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Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization von Shacham-Diamand, Yosi, Dubin, Valery M.

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Method of making the light source structure in flexible substrate von DUBIN VALERY

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Through substrate via (TSuV) structures and method of making the same von DUBIN VALERY

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LIGHT SOURCE STRUCTURES AND METHODS OF MAKING THE SAME von DUBIN VALERY

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DESIGNS AND METHODS FOR CONDUCTIVE BUMPS von DUBIN, Valery M, BOHR, Mark, BALAKRISHNAN, Sridhar

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Designs and methods for conductive bumps von Bohr, Mark, Dubin, Valery M, Balakrishnan, Sridhar

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Method, apparatus and system for providing light source structures on a flexible substrate von DUBIN VALERY

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THROUGH SUBSTRATE VIA (TSUV) STRUCTURES AND METHOD OF MAKING THE SAME von DUBIN VALERY

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