Characterization of hydroxyapatite coatings deposited by hydrothermal electrochemical method on NaOH immersed Ti6Al4V von He, Daihua, Liu, Ping, Liu, Xinkuan, Ma, Fengcang, Chen, Xiaohong, Li, Wei, Du, Jiandi, Wang, Pu, Zhao, Jun

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Microstructure Evolution and Thermal Stability of Cu-15Cr in-situ Composites von 田伟, 毕莉明, DU Jiandi

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Effect of Zr on as-cast microstructure and properties of Cu-Cr alloy von Tian, Wei, Bi, Liming, Ma, Fengcang, Du, Jiandi

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Effect of Ce addition on the microstructure and properties of Al-Cu-Mn-Mg-Fe lithium battery shell alloy von Du, Jiandi, Ding, Dongyan, Zhang, Wenlong, Xu, Zhou, Gao, Yongjin, Chen, Guozhen, You, Xiaohua, Chen, Renzong, Huang, Yuanwei, Tang, Jinsong

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CeLa enhanced corrosion resistance of Al-Cu-Mn-Mg-Fe alloy for lithium battery shell von Du, Jiandi, Ding, Dongyan, Zhang, Wenlong, Xu, Zhou, Gao, Yongjin, Chen, Guozhen, Chen, Weigao, You, Xiaohua, Chen, Renzong, Huang, Yuanwei, Tang, Jinsong

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Effect of CeLa addition on the microstructures and mechanical properties of Al-Cu-Mn-Mg-Fe alloy von Du, Jiandi, Ding, Dongyan, Xu, Zhou, Zhang, Junchao, Zhang, Wenlong, Gao, Yongjin, Chen, Guozhen, Chen, Weigao, You, Xiaohua, Chen, Renzong, Huang, Yuanwei, Tang, Jinsong

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Effect of CeLa addition on the mechanical properties of Al-Cu-Mn-Mg-Fe alloy von Du, Jiandi, Ding, Dongyan, Zhang, Wenlong, Xu, Zhou, Gao, Yongjin, Chen, Guozhen, You, Xiaohua, Chen, Renzong, Huang, Yuanwei, Tang, Jinsong

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Semiconductor Device Package Die Stacking System and Method von Du, Jiandi, Chiu, Hope, Zhang, Yazhou

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Flip-chip package with reduced underfill area von Du, Jiandi, Chiu, Hope, Zhang, Yazhou, Qu, Paul

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Substrate component layout and bonding method for increased package capacity von Zhou, Zengyu, Du, Jiandi, Chiu, Hope, Yuan, Rui, Yu, Fen

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Thermoelectric semiconductor device and method of making same von Du, Jiandi, Zheng, Binbin, Qu, Wenbin, Zhang, Yazhou, Chiu, Chin-Tien, Chandran, Sundarraj

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Semiconductor device including conductive bumps to improve EMI/RFI shielding von Guo, Rui, Zhou, Zengyu, Du, Jiandi, Zheng, Binbin, Chiu, Chin-Tien, Yu, Fen

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FLIP-CHIP PACKAGE WITH REDUCED UNDERFILL AREA von Du, Jiandi, Chiu, Hope, Zhang, Yazhou, Qu, Paul

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THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME von Du, Jiandi, Zheng, Binbin, Qu, Wenbin, Zhang, Yazhou, Chiu, Chin-Tien, Chandran, Sundarraj

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SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI SHIELDING von Guo, Rui, Zhou, Zengyu, Du, Jiandi, Zheng, Binbin, Chiu, Chin-Tien, Yu, Fen

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Semiconductor device package having thermally conductive layers for heat dissipation von Zheng, Gary, Du, Jiandi, Chiu, Hope, Zhang, Yazhou, Chen, Honny, Zhang, Cong, Shen, Ada, Yu, Fen

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SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR HEAT DISSIPATION von Zheng, Gary, Du, Jiandi, Chiu, Hope, Zhang, Yazhou, Chen, Honny, Zhang, Cong, Shen, Ada, Yu, Fen

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Thermoelectric semiconductor device and method of making same von Du, Jiandi, Zheng, Binbin, Qu, Wenbin, Zhang, Yazhou, Chiu, Chin-Tien, Chandran, Sundarraj

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Substrate Component Layout and Bonding Method for Increased Package Capacity von ZHOU, Zengyu, YUAN, Rui, DU, Jiandi, YU, Fen, CHIU, Hope

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Semiconductor device including conductive bumps to improve EMI/RFI shielding von ZHENG BINBIN, QIU JINTIAN, DU JIANDI, ZHOU ZENGYU, YU FEN, GUO RUI

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