Gear Hobs-Cutting Tools and Manufacturing Technologies for Spur Gears: The State of the Art von Hodgyai, Norbert, Máté, Márton, Oancea, Gheorghe, Dragoi, Mircea-Viorel

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A Method to Design Profiled Cutting Tools for Inner Turning von Dragoi, Mircea-Viorel, Parv, Luminita, Mija, Adrian, Oancea, Gheorghe

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Direct Wafer Bonding Methods: A Practical Process Selection Guide von Dragoi, Viorel, Rebhan, Bernhard, Pabo, Eric

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A Fully Symmetrical High Performance Modular Milling Cutter von Dragoi, Mircea-Viorel, Rosca, Dorin Mircea, Folea, Milena Flavia, Oancea, Gheorghe

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Direct Wafer Bonding of GaN for Power Devices Applications von Dragoi, Viorel, Razek, Nasser, Guiot, Eric, Caulmilone, Raphael, Liao, Michael, Wang, Yekan Steven, Goorsky, Mark S., Yates, Luke, Graham, Samuel

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Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding von Flötgen, Christoph, Razek, Nasser, Dragoi, Viorel, Wimplinger, Markus

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Low-Temperature Cu-Cu Wafer Bonding von Rebhan, Bernhard, Hesser, Günter, Duchoslav, Jiri, Dragoi, Viorel, Wimplinger, Markus, Hingerl, Kurt

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Wafer Bonding Process Selection von Dragoi, Viorel, Pabo, Eric

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Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes von Dragoi, Viorel, Lindner, Paul

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Wafer-level plasma activated bonding : new technology for MEMS fabrication von DRAGOI, Viorel, MITTENDORFER, Gerald, THANNER, Christine, LINDNER, Paul

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200 mm Ge Wafer Production for Oxide-Free Si-Ge Direct Wafer Bonding von Rebhan, Bernhard, Vanpaemel, Johannes, Dragoi, Viorel

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Smart Adaptive CNC Machining - State of the Art von Drăgoi, Mircea Viorel, Vasiloni, Anton Mircea

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Aligning Tools on a Press by Means of 3D Scanning von Vasiloni, Mircea Anton, Manolescu, Alexandru, Drăgoi, Mircea Viorel

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Adhesive Wafer Bonding Using Ultra-Thin Spray-Coated BCB Layers von Rimböck, Johanna, Gasiorowski, Jacek, Pires, Mariana, Zenger, Tobias, Burggraf, Jürgen, Dragoi, Viorel

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Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration von Wernicke, Tobias, Rebhan, Bernhard, Vuorinen, Vesa, Paulasto-Krockel, Mervi, Dubey, Vikas, Diex, Kevin, Wünsch, Dirk, Baum, Mario, Wiemer, Maik, Tanaka, Shuji, Froemel, Joerg, Aasmundtveit, Knut Eilif, Nguyen, Hoang-Vu, Dragoi, Viorel

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(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration von Plach, Thomas, Rebhan, Bernhard, Dragoi, Viorel, Wagenleitner, Thomas, Wimplinger, Markus, Lindner, Paul

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Technological restrictions at 3D printing with Zortrax M200 3D printer von Scutaru, Bogdan, Vetrice, Georgiana, Knežević, Ivan, Drăgoi, Viorel, Stamate, Marian

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Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication von Flötgen, Christoph, Razek, Nasser, Dragoi, Viorel, Wimplinger, Markus

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Low-Temperature Aluminum-Aluminum Wafer Bonding von Rebhan, Bernhard, Hinterreiter, Andreas, Malik, Nishant, Schjølberg-Henriksen, Kari, Dragoi, Viorel, Hingerl, Kurt

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Low-Temperature Aluminum-Aluminum Wafer Bonding von Rebhan, Bernhard, Hinterreiter, Andreas, Malik, Nishant, Schjølberg-Henriksen, Kari, Dragoi, Viorel, Hingerl, Kurt

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