Preparation and characterization of composite coatings containing a quaternary ammonium salt as an anti-static agent von Kugimoto, Yuki, Wakabayashi, Atsumi, Dobashi, Toshiaki, Ohnishi, Osamu, Doi, Toshiro K., Kurokawa, Syuhei

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Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology von K. Toshiro DOI, Hideo AIDA, Osamu OHNISHI, Shaohui YIN, Yinghui REN

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Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior von Yamazaki, Tsutomu, Doi, Toshiro K, Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo

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Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage von Sano, Yasuhisa, Doi, Toshiro K, Kurokawa, Syuhei, Aida, Hideo, Ohnishi, Osamu, Uneda, Michio, Shiozawa, Kousuke, Okada, Yu, Yamauchi, Kazuto

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Mn2O3 Slurry Reuse by Circulation Achieving High Constant Removal Rate von Kishii, Sadahiro, Nakamura, Ko, Hanawa, Kenzo, Watanabe, Satoru, Arimoto, Yoshihiro, Kurokawa, Syuhei, Doi, Toshiro K

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Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bow... von DOI, Toshiro K., SESHIMO, Kiyoshi, YAMAZAKI, Tsutomu, OHTSUBO, Masanori, NISHIZAWA, Hideaki, MURAKAMI, Sachi, ICHIKAWA, Daizo, NAKAMURA, Yoshio, MIYASHITA, Tadakazu, KAWAMURA, Yoshihide, TAKAGI, Masataka, KASHIWADA, Hiroshi, AIDA, Hideo

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Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts von Doi, Toshiro K, Sano, Yasuhisa, Kurowaka, Syuhei, Aida, Hideo, Ohnishi, Osamu, Uneda, Michio, Ohyama, Koki

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Analysis of Chemical and Mechanical Factors in CMP Processes for Improving Material Removal Rate von Tamai, Kazusei, Morinaga, Hitoshi, Doi, Toshiro K., Kurokawa, Syuhei, Ohnishi, Osamu

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The Polishing Technology for Glass Substrates Using Tribo-Chemical Reaction and Electrical Slurry Control von Ikeda, Hiroshi, Akagami, Yoichi, Uneda, Michio, Ohnishi, Osamu, Kurokawa, Syuhei, Doi, Toshiro K.

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Mn2O3 Slurry Achieving Reduction of Slurry Waste von Kishii, Sadahiro, Nakamura, Ko, Hanawa, Kenzo, Watanabe, Satoru, Arimoto, Yoshihiro, Kurokawa, Syuhei, Doi, Toshiro K

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Industry-Academia-Government Collaborations Aiming to Establish Ultra-Precision Processing and Its Applications: Potentiality of the Evolution toward Singularity-Focused Innovation von DOI, Toshiro K.

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Precision Profile Measurement System for Microholes Using Vibrating Optical Fiber von Sajima, Takao, Murakami, Hiroshi, Katsuki, Akio, Tabuchi, Daisuke, Ohnishi, Osamu, Kurokawa, Syuhei, Onikura, Hiromichi, Doi, Toshiro K

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Scanning Measurement and Evaluation of Gear Tooth Root and Bottom Profiles von Kido, Hiromitsu, Ohnishi, Osamu, Doi, Toshiro K., Taguchi, Tetsuya, Okada, Tatsuki, Kurokawa, Syuhei

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Effect of Pad Surface Asperity on Removal Rate in Chemical Mechanical Polishing von Maeda, Yuki, Ishikawa, Ken Ichi, Shibuya, Kazutaka, Uneda, Michio, Nakamura, Yoshio, Ichikawa, Koichiro, Doi, Toshiro K.

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Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior von Yamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo

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Advances in CMP/Polishing Technologies for the Manufacture of Electronic Devices von Doi, Toshiro K, Marinescu, Ioan D, Kurokawa, Syuhei

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Tungsten Film Chemical Mechanical Polishing Using MnO2 Slurry von Kishii, Sadahiro, Hatada, Akiyoshi, Arimoto, Yoshihiro, Kurokawa, Syuhei, Doi, Toshiro K

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Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container von Kitamura, Kei, Doi, Toshiro K., Ooki, Yota, Kurokawa, Syuhei, Matsukawa, Yoji, Koshiyama, Isamu, Nakamura, Yoshio, Ichikawa, Koichiro, Umezaki, Yoji, Hasegawa, Tadashi

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Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition von Doi, Toshiro K., Seshimo, Kiyoshi, Yamazaki, Tsutomu, Ohtsubo, Masanori, Ichikawa, Daizo, Miyashita, Tadakazu, Takagi, Masataka, Saeki, Taku, Aida, Hideo

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Mn 2 O 3 Slurry Achieving Reduction of Slurry Waste von Kishii, Sadahiro, Nakamura, Ko, Hanawa, Kenzo, Watanabe, Satoru, Arimoto, Yoshihiro, Kurokawa, Syuhei, Doi, Toshiro K.

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