Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device von Vauche, Laura, Guillemaud, Gabin, Lopes Barbosa, Joao-Carlos, Di Cioccio, Léa

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Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration von Gueguen, Pierric, Ventosa, Caroline, Cioccio, Léa Di, Moriceau, Hubert, Grossi, François, Rivoire, Maurice, Leduc, Patrick, Clavelier, Laurent

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3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly von Fazzi, A., Magagni, L., Mirandola, M., Charlet, B., Di Cioccio, L., Jung, E., Canegallo, R., Guerrieri, R.

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Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force von Berthier, Jean, Mermoz, Sébastien, Brakke, Kenneth, Sanchez, Loic, Frétigny, Christian, Cioccio, Léa Di

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Copper Direct-Bonding Characterization and Its Interests for 3D Integration von Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors von Van Campenhout, J., Binetti, P.R.A., Romeo, P.R., Regreny, P., Seassal, C., Leijtens, X.J.M., de Vries, T., Yoki Siang Oei, van Veldhoven, R.P.J., Notzel, R., Di Cioccio, L., Fedeli, J.-M., Smit, M.K., Van Thourhout, D., Baets, R.

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A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks von Van Campenhout, J., Liu Liu, Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

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Direct bonding for wafer level 3D integration von Di Cioccio, Lea, Radu, Ionut, Gueguen, Pierric, Sadaka, Mariam

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Copper direct bonding: An innovative 3D interconnect von Gueguen, Pierric, Di Cioccio, Léa, Morfouli, Panagiota, Zussy, Marc, Dechamp, Jérome, Bally, Laurent, Clavelier, Laurent

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Hydrogen implantation-induced blistering in diamond : towards diamond layer transfer by the Smart CutTM technique von Masante, Cédric, de Vecchy, Jon, Mazen, Frédéric, Milesi, Frederic, Di Cioccio, Léa, Pernot, Julien, Lloret, Fernando, Araujo, Daniel, Pinero, José Carlos, Rochat, Névine, Pierre, Francois, Servant, Florence, Widiez, Julie

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Design and Optimization of Electrically Injected InP-Based Microdisk Lasers Integrated on and Coupled to a SOI Waveguide Circuit von Van Campenhout, J., Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

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Contribution of numerical simulation to silicon carbide bulk growth and epitaxy von Meziere, Jérôme, Pons, Michel, Cioccio, Léa Di, Blanquet, Elisabeth, Ferret, Pierre, Dedulle, Jean-Marc, Baillet, Francis, Pernot, Etienne, Anikin, Michaïl, Madar, Roland, Billon, Thierry

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Modeling and Integration Phenomena of metal-metal direct bonding technology von Di Cioccio, Lea, Baudin, Floriane, Gergaud, Patrice, Delaye, Vincent, Jouneau, Pierre-Henri, Rieutord, François, Signamarcheix, Thomas

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Vertical metal interconnect thanks to tungsten direct bonding von Di Cioccio, Léa, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean François, Clavelier, Laurent

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Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits von Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Room-temperature InAs/InP Quantum Dots laser operation based on heterogeneous "2.5 D" Photonic Crystal von Ben Bakir, Badhise, Seassal, Christian, Letartre, Xavier, Regreny, Philippe, Gendry, Michel, Viktorovitch, Pierre, Zussy, Marc, Di Cioccio, Léa, Fedeli, Jean-Marc

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Full characterization of Cu/Cu direct bonding for 3D integration von Taibi, Rachid, Di Cioccio, Léa, Chappaz, Cedrick, Chapelon, Laurent-Luc, Gueguen, Pierric, Dechamp, Jérome, Fortunier, Roland, Clavelier, Laurent

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New Heterostructures and 3D Devices Obtained at CEA/LETI by the Bonding and Thinning Method von Di Cioccio, Léa

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Self-alignment of Silicon Chips on Wafers: a Numerical Investigation of the Effect of Spreading and Wetting von Berthier, Jean, Brakke, Kenneth, Mermoz, Sébastien, Sanchez, Loïc, Fretigny, Christian, Di Cioccio, Léa

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Silicon Die Self-alignment on a Wafer: Stable and Unstable Modes von Berthier, Jean, Brakke, Kenneth, Grossi, François, Sanchez, Lo¨c, Di Cioccio, Léa

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