A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films von Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Schöberl, Thomas, Pippan, Reinhard, Motz, Christian, Dehm, Gerhard

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Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs von Verzellesi, Giovanni, Morassi, Luca, Meneghesso, Gaudenzio, Meneghini, Matteo, Zanoni, Enrico, Pozzovivo, Gianmauro, Lavanga, Simone, Detzel, Thomas, Haberlen, Oliver, Curatola, Gilberto

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Interface fracture properties of thin films studied by using the micro-cantilever deflection technique von Matoy, Kurt, Detzel, Thomas, Müller, Matthias, Motz, Christian, Dehm, Gerhard

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Fast System to measure the dynamic on-resistance of on-wafer 600 V normally off GaN HEMTs in hard-switching application conditions von Barbato, Alessandro, Barbato, Marco, Meneghini, Matteo, Silvestri, Marco, Detzel, Thomas, Haeberlen, Oliver, Spiazzi, Giorgio, Meneghesso, Gaudenzio, Zanoni, Enrico

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Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers von Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Dehm, Gerhard

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On the temperature dependence of Na migration in thin SiO 2 films during ToF-SIMS O 2 + depth profiling von Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert

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The effect of bias-temperature stress on Na+ incorporation into thin insulating films von Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

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On the temperature dependence of Na migration in thin SiO2 films during ToF-SIMS O2+ depth profiling von Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert

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On the temperature dependence of Na migration in thin Si02 films during ToF-SIMS O2+ depth profiling von KRIVEC, Stefan, DETZEL, Thomas, BUCHMAYR, Michael, HUTTER, Herbert

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Erratum to: The effect of bias-temperature stress on [Na.sup.+] incorporation into thin insulating films von Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hatter, Herbert

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Erratum to: The effect of bias-temperature stress on Na+ incorporation into thin insulating films von Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

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The effect of bias-temperature stress on N[a.sup.+] incorporation into thin insulating films von Krivec, Stefan, Buchmayr, Michael, Detzel, Thomas, Froemling, Till, Fleig, Juergen, Hutter, Herbert

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The effect of bias-temperature stress on Na+ incorporation into thin insulating films : Applied Surface Analysis von KRIVEC, Stefan, BUCHMAYR, Michael, DETZEL, Thomas, FROEMLING, Till, FLEIG, Juergen, HUTTER, Herbert

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Microscopic stress simulation of non-planar chip technologies von Zarbakhsh, Javad, Karunamurthy, Balamurugan, Trejo-Caballero, Carlos O., Barti, Endre, Detzel, Thomas

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HIGH ELECTRON MOBILITY TRANSISTOR WITH DOPED SEMICONDUCTOR REGION IN GATE STRUCTURE von Haeberlen, Oliver, Prechtl, Gerhard, Detzel, Thomas

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High electron mobility transistor with doped semiconductor region in gate structure von Haeberlen, Oliver, Prechtl, Gerhard, Detzel, Thomas

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Modeling of stress evolution of electroplated Cu films during self-annealing von Rui Huang, Robl, Werner, Detzel, Thomas, Ceric, Hajdin

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High Electron Mobility Transistor with Doped Semiconductor Region in Gate Structure von Haeberlen, Oliver, Prechtl, Gerhard, Detzel, Thomas

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High electron mobility transistor with doped semiconductor region in gate structure von Haeberlen, Oliver, Prechtl, Gerhard, Detzel, Thomas

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Thermomechanical Stresses in Copper Films at Elevated Temperature von LEDERER, Martin, ZARBAKHSH, Javad, RUI HUANG, DETZEL, Thomas, WEISS, Brigitte

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