Through-layer XPS investigations of the Si3N4/AlGaN interface von Reiner, Maria, Denifl, Guenter, Stadtmueller, Michael, Pietschnig, Rudolf, Ostermaier, Clemens

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Through-layer XPS investigations of the Si sub(3)N sub(4)/AlGaN interface von Reiner, Maria, Denifl, Guenter, Stadtmueller, Michael, Pietschnig, Rudolf, Ostermaier, Clemens

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Through‐layer XPS investigations of the Si 3 N 4 /AlGaN interface von Reiner, Maria, Denifl, Guenter, Stadtmueller, Michael, Pietschnig, Rudolf, Ostermaier, Clemens

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Physical-chemical stability of fluorinated III-N surfaces: Towards the understanding of the (0001) AlxGa1-xN surface donor modification by fluorination von Reiner, Maria, Schellander, Josef, Denifl, Günter, Stadtmueller, Michael, Schmid, Michael, Frischmuth, Tobias, Schmid, Ulrich, Pietschnig, Rudolf, Ostermaier, Clemens

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Enhanced Equipment and New Processes As Enabler for Power Technologies on 300mm Substrates von Engelhardt, Manfred, Baumgartl, Johannes, Denifl, Guenter, Ehrentraut, Georg, Kuenle, Matthias, Stadtmueller, Michael, Werner, Sebastian, Crippa, Danilo, Kraft, Martin

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Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures von Santos Rodriguez, Francisco Javier, Brockmeier, Andre, Piccin, Matteo, Denifl, Guenter, Knabl, Michael, Kern, Ronny

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POWER SEMICONDUCTOR DEVICE HAVING A STRAIN-INDUCING MATERIAL EMBEDDED IN AN ELECTRODE von STADTMUELLER, Michael, BLANK, Oliver, DENIFL, Guenter, GALASSO, Germano, SCHULZE, Hans-Joachim, ROY, Saurabh, KARNER, Stefan

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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTURES LATERALLY SURROUNDING BACKSIDE METAL STRUCTURES von Santos Rodriguez, Francisco Javier, Brockmeier, Andre, Piccin, Matteo, Denifl, Guenter, Knabl, Michael, Kern, Ronny

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Semiconductor device and method of manufacturing a semiconductor device von Santos Rodriguez, Francisco Javier, Brockmeier, Andre, Piccin, Matteo, Denifl, Guenter, Knabl, Michael, Kern, Ronny

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Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers von Santos Rodriguez, Francisco Javier, Denifl, Guenter, Lehnert, Wolfgang, Rupp, Roland, Hoechbauer, Tobias Franz Wolfgang, Schulze, Hans-Joachim, Huber, Martin

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Verfahren zum Ausbilden von Halbleiterbauelementen von Kahn, Markus, Denifl, Guenter, Stranzl, Gudrun, Zgaga, Martin

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Micromechanical structure and method for manufacturing the same von Kahn, Markus, Schmid, Ulrich, Grille, Thomas, Denifl, Guenter, Maurer, Daniel, Frischmuth, Tobias, Hedenig, Ursula, Schneider, Michael

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Semiconductor Device and Method of Manufacturing a Semiconductor Device von Santos Rodriguez, Francisco Javier, Brockmeier, Andre, Piccin, Matteo, Denifl, Guenter, Knabl, Michael, Kern, Ronny

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Methods of forming semiconductor devices von Denifl Guenter, Kahn Markus, Stranzl Gudrun, Zgaga Martin

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MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD ARTICLE von Denifl Guenter, Brockmeier Andre, Kahn Markus, Breymesser Alexander

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Methods of Forming Semiconductor Devices von Denifl Guenter, Kahn Markus, Stranzl Gudrun, Zgaga Martin

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Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device von Goller, Bernhard, Denifl, Guenter, Lehnert, Wolfgang, Rupp, Roland, Breymesser, Alexander, Draghici, Mihai, Schulze, Hans-Joachim, Hoechbauer, Tobias Franz Wolfgang, Schustereder, Werner

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Method for Protecting a Surface of a Substrate and Semiconductor Device von Kueck Daniel, Denifl Guenter, Eigler Werner, Moennich Roland

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Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor Wafers, and Wide Band Gap Semiconductor Wafers von Santos Rodriguez, Francisco Javier, Denifl, Guenter, Lehnert, Wolfgang, Rupp, Roland, Hoechbauer, Tobias Franz Wolfgang, Schulze, Hans-Joachim, Huber, Martin

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Processing a sacrificial material during manufacture of a microfabricated product von Denifl Guenter, Hirschler Joachim, Grille Thomas, Kahn Markus, Maurer Daniel

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