Nonlinear flux flow in TiN superconducting thin film von Lefloch, F., Hoffmann, C., Demolliens, O.

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Formation of Al3Ti during physical vapour deposition of titanium on aluminium von Ulmer, L., Pitard, F., Poncet, D., Demolliens, O.

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Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture von MOTTE, P, TORRES, J, PALLEAU, J, TARDIF, F, DEMOLLIENS, O, BERNARD, H

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Cleaning after silicon oxide CMP von Tardif, F., Constant, I., Lardin, T., Demolliens, O., Fayolle, M., Gobil, Y., Palleau, J., Torres, J.

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Wet cleanings adapted to backend processes von Tardif, F., Palleau, J., Lardin, T., Demolliens, O., Vincent, A., Torres, J.

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Study of fluorine stability in fluoro-silicate glass and effects on dielectric properties von Passemard, Gérard, Fugier, Pascal, Noel, Patrice, Pires, Fabrice, Demolliens, Olivier

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Dielectric deposition process for Cu/SiO 2 integration in a dual damascene interconnection architecture von Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Dielectric deposition process for Cu/SiO sub(2) integration in a dual damascene interconnection architecture von Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Properties of Nb3Ge tapes for high field magnets von DEMOLLIENS, O, WEISS, F, MADAR, R, SENATEUR, J. P, VALLIER, J. C

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Formation of Al sub 3 Ti during physical vapour deposition of titanium on aluminium von Ulmer, L, Pitard, F, Poncet, D, Demolliens, O

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Dielectric deposition process for Cu/SiO sub 2 integration in a dual damascene interconnection architecture von Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Formation of Al 3Ti during physical vapour deposition of titanium on aluminium von Ulmer, L., Pitard, F., Poncet, D., Demolliens, O.

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New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration von Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A.

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Copper dual damascene integration using organic low k material: construction architecture comparison von Morand, Y., Assous, M., Berruyer, P., Cochet, M., Demolliens, O., Fayolle, M., Louis, D., Passemard, G., Roman, A., Verove, C., Trouiller, Y.

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Copper-SiOC-AirGap integration in a double level metal interconnect von Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., Lugard, J.F., Renaud, D.

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Copper-silk integration in a 0.18μm double level metal interconnect von DEMOLLIENS, O, BERRUYER, P, LOUIS, D, ARVET, C, LAJOINIE, E, GOBIL, Y, PASSEMARD, G, JOURDAN, F, MOUSSAVI, M, CORDEAU, M, MOREL, T, MOURIER, T, MORAND, Y, ULMER, L, SICURANI, E, TARDIF, F, BEVERINA, A, TROUILLET, Y, RENAUD, D, TABONE, C, ROMAN, A, COCHET, M, ASSOUS, M, FELDIS, H, BLANC, R, TABOURET, E

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Differential body effect analysis and optimization of the LArge Tilt Implanted Sloped Shallow Trench Isolation Process (LATI-STI) von DELEONIBUS, S, HEITMANN, M, GOBIL, Y, MARTIN, F, DEMOLLIENS, O, GUIBERT, J.-C, TOFFOLI, A

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Copper Integration In Self Aligned Dual Damascene Architecture von Morand, Lerme, Palleau, Torres, Vinet, Demolliens, Ulmer, Gobil, Fayolle, Romagna, Le Bihan

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Non linear flux flow in TiN superconducting thin film von Lefloch, F, Hoffmann, C, Demolliens, O

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Shallow Trench Isolation for High Density Flash Memories von Deleonibus, S., Heitzmann, M., Gobil, Y., Martin, F., Demolliens, O., Guillaumot, B., Candelier, P., Guibert, J.C.

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