The evolution of the segregation behavior of alloying elements in a low-alloy steel von Papworth, Adam J., Knorr, David B., Williams, David B.

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The properties of tin-bismuth alloy solders von Felton, Lawrence E., Raeder, Christopher H., Knorr, David B.

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Stability of YBa2Cu3O7-x in Molten Chloride Salts von Raeder, Christopher H., Knorr, David B.

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Model for predicting thermal stresses in thin polycrystalline films von Yu, Jiun-Shya, Maniatty, Antoinette M., Knorr, David B.

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The multichip module as a board-level package von Knorr, David B.

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Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films von Campbell, Ann N., Mikawa, Russell E., Knorr, David B.

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Applications of texture in thin films von Knorr, David B., Szpunar, Jerzy A.

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Mechanical aspects of multichip module reliability von Knorr, David B.

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Electronic packaging activities at the Rensselaer Polytechnic Institute’s Center for Integrated Electronics von Knorr, David B.

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Foreword von Knorr, David B., Merchant, Harish D.

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Foreword von Rajan, Krishna, Knorr, David B., Sanchez, John E.

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Stability of YBa 2 Cu 3 O 7‐x in Molten Chloride Salts von Raeder, Christopher H., Knorr, David B.

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Stability of YBa sub 2 Cu sub 3 O sub 7 sub - sub x in molten chloride salts von Raeder, Christopher H, Knorr, David B

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Practical applications in texture analysis von Knorr, David B., Weiland, Hasso

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Editorial von Knorr, David B., Hirsch, Jürgen

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Deformation mechanism mapping of α-Zr and zircaloy-2 von Knorr, David B., Notis, Michael R.

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COPPER ALLOYS HAVING AN IMPROVED COMBINATION OF STRENGTH AND CONDUCTIVITY von BREEDIS, JOHN F, KNORR, DAVID B

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COPPER ALLOY HAVING AN IMPROVED COMBINATION OF STRENGTH AND CONDUCTIVITY von DAVID B. KNORR, JOHN F. BREEDIS

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COPPER ALLOYS HAVING AN IMPROVED COMBINATION OF STRENGTH AND CONDUCTIVITY von BREEDIS, JOHN F, KNORR, DAVID B

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COPPER ALLOY HAVING AN IMPROVED COMBINATION OF STRENGTH AND CONDUCTIVITY von DAVID B. KNORR, JOHN F. BREEDIS

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