Vibration lifetime modelling of PCB assemblies using steinberg model von Dehbi, A., Ousten, Y., Danto, Y., Wondrak, W.

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Long-term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests von Deshayes, Y., Bechou, L., Verdier, F., Danto, Y.

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Improved physical understanding of intermittent failure in continuous monitoring method von Filho, W.C. Maia, Brizoux, M., Frémont, H., Danto, Y.

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Torsion test applied for reballing and solder paste volume evaluation von Maia Filho, W.C., Brizoux, M., Frémont, H., Danto, Y.

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High temperature reliability testing of aluminum and tantalum electrolytic capacitors von Dehbi, A., Wondrak, W., Ousten, Y., Danto, Y.

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Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations von Delétage, J.-Y., Verdier, F.J.-M., Plano, B., Deshayes, Y., Bechou, L., Danto, Y.

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Early failure signatures of 1310 nm laser modules using electrical, optical and spectral measurements von Deshayes, Y, Bechou, L, Mendizabal, L, Danto, Y

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Reliability evaluation of adhesive bonded SMT components in industrial applications von Périchaud, M.G., Delétage, J.Y., Frémont, H., Danto, Y., Faure, C.

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A physical approach on SCOBIC investigation in VLSI von Beauchêne, T., Lewis, D., Beaudoin, F., Pouget, V., Perdu, P., Fouillat, P., Danto, Y.

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An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy von Bechou, L., Dallet, D., Danto, Y., Daponte, P., Ousten, Y., Rapuano, S.

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Reliability of Low-Cost PCB Interconnections for Telecommunication Applications von DUCHAMP, G, VERDIER, F, DESHAYES, Y, MARC, F, OUSTEN, Y, DANTO, Y

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Moisture diffusion in BCB resins used for MEMS packaging von Tetelin, A., Pellet, C., Delétage, J-Y., Carbonne, B., Danto, Y.

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Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests von MENDIZABAL, L, BECHOU, L, DESHAYES, Y, VERDIER, F, DANTO, Y, LAFFITTE, D, GOUDARD, J. L, HOUE, F

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Acoustic analysis of an assembly: Structural identification by signal processing (wavelets) von Augereau, J., Ousten, Y., Béchou, L., Danto, Y.

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Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm Laser modules von Deshayes, Y., Bechou, L., Deletage, J.Y., Verdier, F., Danto, Y., Laffitte, D., Goudard, J.L.

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Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study von Mongellaz, B., Marc, F., Danto, Y.

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Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions von Trégon, B., Ousten, Y., Danto, Y., Bechou, L., Parmentier, B.

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Electroluminescence spectroscopy for reliability investigations of 1.55 μm bulk semiconductor optical amplifier von Huyghe, S., Bechou, L., Zerounian, N., Deshayes, Y., Aniel, F., Denolle, A., Laffitte, D., Goudard, J.L., Danto, Y.

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Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language von Mongellaz, B., Marc, F., Milet-Lewis, N., Danto, Y.

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First steps toward ageing simulation of complex analogue circuits with behavioural modelling von Marc, F., Danto, Y.

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