Transcriptomic and functional characterization reveals CsHAK5;3 as a key player in K+ homeostasis in grafted cucumbers under saline conditions von Peng, Yuquan, Cao, Haishun, Peng, Zhaowen, Zhou, Lijian, Sohail, Hamza, Cui, Lvjun, Yang, Li, Huang, Yuan, Bie, Zhilong

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CsAKT1 is a key gene for the CeO2 nanoparticle's improved cucumber salt tolerance: a validation from CRISPR-Cas9 lines von Peng, Yuquan, Chen, Linlin, Zhu, Lan, Cui, Lvjun, Yang, Li, Wu, Honghong, Bie, Zhilong

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is a key gene for the CeO nanoparticle's improved cucumber salt tolerance: a validation from CRISPR-Cas9 lines von Peng, Yuquan, Chen, Linlin, Zhu, Lan, Cui, Lvjun, Yang, Li, Wu, Honghong, Bie, Zhilong

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CsAKT1 is a key gene for the CeO 2 nanoparticle's improved cucumber salt tolerance: a validation from CRISPR-Cas9 lines von Peng, Yuquan, Chen, Linlin, Zhu, Lan, Cui, Lvjun, Yang, Li, Wu, Honghong, Bie, Zhilong

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CmoNAC1 in pumpkin rootstocks improves salt tolerance of grafted cucumbers by binding to the promoters of CmoRBOHD1, CmoNCED6, CmoAKT1;2 and CmoHKT1;1 to regulate H2O2, ABA signali... von Peng, Yuquan, Cao, Haishun, Cui, Lvjun, Wang, Ying, Wei, Lanxing, Geng, Shouyu, Yang, Li, Huang, Yuan, Bie, Zhilong

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Pumpkin CmoDREB2A enhances salt tolerance of grafted cucumber through interaction with CmoNAC1 to regulate H2O2 and ABA signaling and K+/Na+ homeostasis von Peng, Yuquan, Cui, Lvjun, Wang, Ying, Wei, Lanxing, Geng, Shouyu, Chen, Hui, Chen, Guoyu, Yang, Li, Bie, Zhilong

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Pumpkin CmoDREB2A enhances salt tolerance of grafted cucumber through interaction with CmoNAC1 to regulate H 2 O 2 and ABA signaling and K + /Na + homeostasis von Peng, Yuquan, Cui, Lvjun, Wang, Ying, Wei, Lanxing, Geng, Shouyu, Chen, Hui, Chen, Guoyu, Yang, Li, Bie, Zhilong

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Heat-treatment induced microstructural evolution and enhanced mechanical property of selective laser melted near β Ti-5Al-5Mo-5 V-3Cr-1Zr alloy von Deng, Hao, Qiu, Wenbin, Cao, Sheng, Chen, Longqing, Hu, Zhendong, Wei, Yongqiang, Xia, Zuxi, Zhou, Lvjun, Cui, Xudong, Tang, Jun

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Morphological effects on the electrochemical dissolution behavior of forged and additive manufactured Ti-6Al-4V alloys in runway deicing fluid von Zhou, Lvjun, Deng, Hao, Chen, Longqing, Qiu, Wenbin, Wei, Yongqiang, Peng, Huaqiao, Hu, Zhendong, Lu, Dong, Cui, Xudong, Tang, Jun

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