The role of microstructure in the thermal fatigue of solder joints von Xian, J, Xu, Y, Stoyanov, S, Coyle, RJ, Dunne, F, Gourlay, C

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Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints von Xu, Y, Xian, J, Coyle, RJ, Gourlay, CM, Dunne, FPE

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Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony von Belyakov, SA, Coyle, RJ, Arfaei, B, Xian, JW, Gourlay, CM

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The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version) von Coyle, R.J., Popps, D.E.H., Mawer, A., Cullen, D.P., Wenger, G.M., Solan, P.P.

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Solder metallization interdiffusion in microelectronic interconnects von Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

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Electrostatic discharge failure mechanism for cordless phone charge contacts von Coyle, Richard J, Jon, Min-Chung

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Altered load dependence of postischemic myocardium von Buffington, C W, Coyle, R J

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The influence of test parameters and package design features on ball shear test requirements von Coyle, R.J., Solan, P.P.

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Regional Load Dependence of Postischemic Myocardium von Buffington, Charles W., Coyle, Richard J., Watanabe, Seiji

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Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages von Coyle, R.J., Serafino, A.J., Solan, P.P.

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The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array von Coyle, R.J., Wenger, G.M., Hodges, D.E., Mawer, A., Cullen, D.P., Solan, P.P.

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Laser weld process improvements for optical isolator assembly von Kowalski, V.T., Coyle, R.J., Solan, P.P., Hogan, K.M.

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Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages von Coyle, R.J., Ejim, T.I., Holliday, A., Solan, P.P., Dorey, J.K.

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Assembly and reliability of thermally enhanced high I/O BGA packages von Ejim, T.I., Hollesen, D.B., Holliday, A., Gahr, S.A., Coyle, R.J.

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The ternary subsystem Sn4As3-Bi-SnAs von Coyle, R. J., Peretti, E. A.

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Constitution of the tin-rich and bismuth-rich regions of the tin-bismuth-arsenic ternary system von Coyle, R.J., Vacha, C., Peretti, E.A.

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Gene Knockout of Glycine Transporter 1: Characterization of the Behavioral Phenotype von Tsai, Guochuan, Ralph-Williams, Rebecca J., Martina, Marzia, Bergeron, Richard, Berger-Sweeney, Joanne, Dunham, Kevin S., Jiang, Zhichun, Caine, S. Barak, Coyle, Joseph T., Scolnick, Edward M.

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Practice Guidelines for the Treatment of Lyme Disease von Wormser, Gary P., Nadelman, Robert B., Dattwyler, Raymond J., Dennis, David T., Shapiro, Eugene D., Steere, Allen C., Rush, Thomas J., Rahn, Daniel W., Coyle, Patricia K., Persing, David H., Fish, Durland, Luft, Benjamin J.

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A critical role for the programmed death ligand 1 in fetomaternal tolerance von Guleria, Indira, Khosroshahi, Arezou, Ansari, Mohammed Javeed, Habicht, Antje, Azuma, Miyuki, Yagita, Hideo, Noelle, Randolph J, Coyle, Anthony, Mellor, Andrew L, Khoury, Samia J, Sayegh, Mohamed H

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Ectopy-triggering ganglionated plexus ablation to prevent atrial fibrillation: GANGLIA-AF study von Kim, M-Y, Coyle, C, Tomlinson, DR, Sikkel, MB, Sohaib, A, Luther, V, Leong, KM, Malcolme-Lawes, L, Low, B, Sandler, B, Lim, E, Todd, M, Fudge, M, Wright, I, Koa-Wing, M, Ng, FS, Qureshi, NA, Whinnett, ZI, Peters, NS, Newcomb, D, Wood, C, Dhillon, G, Hunter, RJ, Lim, PB, Linton, NW, Kanagaratnam, P

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