Cyclic twin nucleation in tin-based solder alloys von Lehman, L.P., Xing, Y., Bieler, T.R., Cotts, E.J.

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature von Arfaei, B., Kim, N., Cotts, E.J.

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Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints von Bieler, T.R., Hairong Jiang, Lehman, L.P., Kirkpatrick, T., Cotts, E.J., Nandagopal, B.

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THERMAL EXPANSION OF SEVERAL Sn-BASED INTERMETALLIC COMPOUNDS von Jiang, Nan, Clum, J.A, Chromik, R.R, Cotts, E.J

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Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling von Seungbae Park, Dhakal, R., Lehman, L., Cotts, E.J.

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Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface von Liu, Y, Wang, J, Yin, L, Kondos, P, Parks, C, Borgesen, P, Henderson, D W, Cotts, E J, Dimitrov, N

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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue von Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Erratum to “Cyclic twin nucleation in tin based solder alloys” [Acta Materialia 58 (2010) 3546–3556] von Lehman, L.P., Xing, Y., Bieler, T.R., Cotts, E.J.

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Solder metallization interdiffusion in microelectronic interconnects von Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

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Improving Copper Electrodeposition in the Microelectronics Industry von Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.

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Horizontal capillary flow of a Newtonian liquid in a narrow gap between a plane wall and a sinusoidal wall von Davidson, D., Lehmann, G.L., Cotts, E.J.

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Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors von Fullem, T.Z., Lehman, L.P., Cotts, E.J.

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Crystal structure of Au1-xNixSn4 intermetallic alloys von ZAVALIJ, L, ZRIBI, A, CHROMIK, R. R, PITELY, S, ZAVALIJ, P. Y, COTTS, E. J

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Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories von Lehman, L.P., Kinyanjui, R.K., Zavalij, L., Zribi, A., Cotts, E.J.

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Crystal structure of Au 1− xNi xSn 4 intermetallic alloys von Zavalij, L, Zribi, A, Chromik, R.R, Pitely, S, Zavalij, P.Y, Cotts, E.J

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Underflow process for direct-chip-attachment packaging von Lehmann, G.L., Driscoll, T., Guydosh, N.R., Li, P.C., Cotts, E.J.

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Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints von Bieler, T.R., Jiang, H., Lehman, L.P., Kirkpatrick, T., Cotts, E.J.

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Calorimetric study of amorphization in planar, binary, multilayer, thin-film diffusion couples of Ni and Zr von COTTS, E. J, MENG, W. J, JOHNSON, W. L

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The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic joints von Zribi, A., Zavalij, L., Borgesen, P., Primavera, A., Westby, G., Cotts, E.J.

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Thermal time constants in differential scanning calorimetry von Patt, M.E., White, B.E., Stein, B., Cotts, E.J.

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