Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure von Benson, D.A., Cole, E.I. Jr, Tangyunyong, Paiboon

Volltext

Global fault localization using induced voltage alteration von Cole Jr, Edward I

Volltext

Backside localization of open and shorted IC interconnections von Cole, E.I. Jr, Tangyunyong, P., Barton, D.L.

Volltext bestellen

Resistive contrast imaging: A new SEM mode for failure analysis von Smith, C.A., Bagnell, C.R., Cole, E.I., DiBianca, F.A., Johnson, D.G., Oxford, W.V., Propst, R.H.

Volltext