Nanothermal Interface Materials: Technology Review and Recent Results von Bar-Cohen, Avram, Matin, Kaiser, Narumanchi, Sreekant

Volltext

Superlattice-based thin-film thermoelectric modules with high cooling fluxes von Bulman, Gary, Barletta, Phil, Lewis, Jay, Baldasaro, Nicholas, Manno, Michael, Bar-Cohen, Avram, Yang, Bao

Volltext

Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit von Shi, Bing, Srivastava, Ankur, Bar-Cohen, Avram

Volltext

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module von Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Volltext

On-chip hot spot cooling using silicon thermoelectric microcoolers von Wang, Peng, Bar-Cohen, Avram

Volltext

Enhancement of pool boiling critical heat flux in dielectric liquids by microporous coatings von Arik, Mehmet, Bar-Cohen, Avram, You, Seung Mun

Volltext

Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows von Kim, Kyoung Joon, Yang, Hyeon Ho, Noh, Wooheon, Han, Bongtae, Bar-Cohen, Avram

Volltext

Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids von Arik, Mehmet, Bar-Cohen, Avram

Volltext

Professor Yogesh Jaluria on his 70th Birthday von Acharya, Sumanta, Amon, Cristina, Ayyaswamy, Portonovo, Battaglia, Francine, Bejan, Adrian, Chen, Gang, Cheng, Ping, Chiu, Wilson K.S., Cohen, Avram Bar, Cotta, Renato, Dombrovsky, Leonid, Faghri, Mohammad, George, Pradeep, Joshi, Yogendra, Kang, Byung Ha, Karwe, Mukund, Klausner, James F., Lele, Sanjiva, Lorenzini, Giulio, Manca, Oronzio, Minkowycz, W.J., Papanicolaou, Elias, Patankar, Suhas V., Pepper, Darrell, Peterson, G.P. “Bud”, Prasad, Vishwanath, Sunden, Bengt, Tao, Wen-Quan, Wang, L.Q. “Rick”, Zhao, Tianshou

Volltext

Energy Efficient Two-Phase Microcooler Design for a Concentrated Photovoltaic Triple Junction Cell von Reeser, Alexander, Wang, Peng, Hetsroni, Gad, Bar-Cohen, Avram

Volltext

Analytical modeling of silicon thermoelectric microcooler von Wang, Peng, Bar-Cohen, Avram, Yang, Bao, Solbrekken, Gary L., Shakouri, Ali

Volltext

[Encyclopedia] Encyclopedia of Thermal Packaging (Set 1) Thermal Packaging Techniques, Volumes 1-6 von Bar-Cohen Avram

Volltext

Thermal Management of On-Chip Hot Spot von Bar-Cohen, Avram, Wang, Peng

Volltext

System-level Pareto frontiers for on-chip thermoelectric coolers von U. YURUKER, Sevket, C. FISH, Michael, YANG, Zhi, BALDASARO, Nicholas, BARLETTA, Philip, BAR-COHEN, Avram, YANG, Bao

Volltext

Gen 3 "Embedded" Cooling: Key Enabler for Energy Efficient Data Centers von Bar-Cohen, Avram

Volltext

Life prediction of LED-based recess downlight cooled by synthetic jet von Song, Bong-Min, Han, Bongtae, Bar-Cohen, Avram, Arik, Mehmet, Sharma, Rajdeep, Weaver, Stan

Volltext

Near-junction “hot spot” suppression with integral SiC microcontact TEC von Manno, Michael, Yang, Bao, Bar-Cohen, Avram

Volltext

Thermal management of high heat flux nanoelectronic chips von Bar-Cohen, Avram, Wang, Peng, Rahim, Emil

Volltext

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results von Bar-Cohen, Avram, Matin, Kaiser, Jankowski, Nicholas, Sharar, Darin

Volltext

Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm von Bar-Cohen, Avram

Volltext