THERMAL EXPANSION OF SEVERAL Sn-BASED INTERMETALLIC COMPOUNDS von Jiang, Nan, Clum, J.A, Chromik, R.R, Cotts, E.J

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Solder metallization interdiffusion in microelectronic interconnects von Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

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Consideration of the bulk impurity effect in surface self-diffusion measurements von Clum, J.A.

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Teaching electroscience using computer-based instruction von Al-Holou, N., Clum, J.A.

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Comments on observed streaking in field-ion microscopy images of tungsten-10 at. % rhenium von Clum, J.A., Moazed, K.L.

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Interfacial chemistry in magnesium modified nodular iron von Johnson, W.C, Kovacs, B.V, Clum, J.A

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