Influence of Tin Deposition Methods on Tin Whisker Formation von Pinol, L. A., Melngailis, J., Charles, H. K., Lee, D. M., Deacon, R., Coles, G., Clatterbaugh, G.

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Electrical Characterisation and Design of Multilayer Thick Film Circuit Boards for High Speed Digital Applications von Clatterbaugh, G, Charles, H.K

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Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples von Clatterbaugh, G., Weiner, J., Charles, H.

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Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates von Francomacaro, A.S., Charles, H.K., Lehtonen, S.J., Keeney, A.C., Clatterbaugh, G.V., Banda, C.V.

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Some key issues in microelectronic packaging von Clatterbaugh, Guy V, Vichot, Paul, Charles, Harry K

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Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An I... von Clatterbaugh, G V, Charles, H K , Jr

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1984 IR&D (Independent Research and Development) Advanced Packaging Study von Clatterbaugh,G V, Charles,H C , Jr

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The effect of high-temperature intermetallic growth on ball shear-induced cratering von Clatterbaugh, G.V., Charles, H.K.

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MRI flex circuit catheter imaging coil von HALPERIN HENRY R, PALMER JAMES G, CLATTERBAUGH GUY V, VICHOT PAUL A

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