Influence of absorbed water components on SiOCH low- k reliability von Li, Yunlong, Ciofi, Ivan, Carbonell, Laureen, Heylen, Nancy, Van Aelst, Joke, Baklanov, Mikhaïl R., Groeseneken, Guido, Maex, Karen, Tőkei, Zsolt

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Capacitance measurements and k-value extractions of low- k films von Ciofi, Ivan, Baklanov, Mikhail R., Tőkei, Zsolt, Beyer, Gerald P.

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Resistance modeling of short-range connections: impact of current spreading von Tierno, Davide, Vega-Gonzalez, Victor, Esposto, Simone, Ciofi, Ivan

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Evaluation of a New Advanced Low-$k$ Material von Smirnov, Evgeny A, Vanstreels, Kris, Verdonck, Patrick, Ciofi, Ivan, Shamiryan, Denis, Baklanov, Mikhail R, Phillips, Mark

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RC Benefits of Advanced Metallization Options von Ciofi, Ivan, Roussel, Philippe J., Baert, Rogier, Contino, Antonino, Gupta, Anshul, Croes, Kristof, Wilson, Christopher J., Mocuta, Dan, Tokei, Zsolt

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Variability-Aware Predictive Modeling of Line-to-Line Dielectric Reliability von Ciofi, Ivan, Roussel, Philippe J., Wilson, Christopher J., Croes, Kristof

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Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper von Wen, Liang Gong, Roussel, Philippe, Pedreira, Olalla Varela, Briggs, Basoene, Groven, Benjamin, Dutta, Shibesh, Popovici, Mihaela I, Heylen, Nancy, Ciofi, Ivan, Vanstreels, Kris, Østerberg, Frederik W, Hansen, Ole, Petersen, Dirch H, Opsomer, Karl, Detavernie, Christophe, Wilson, Christopher J, Elshocht, Sven Van, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt, Adelmann, Christoph

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Impact of Wire Geometry on Interconnect RC and Circuit Delay von Ciofi, Ivan, Contino, Antonino, Roussel, Philippe J., Baert, Rogier, Vega-Gonzalez, Victor H., Croes, Kristof, Badaroglu, Mustafa, Wilson, Christopher J., Raghavan, Praveen, Mercha, Abdelkarim, Verkest, Diederik, Groeseneken, Guido, Mocuta, Dan, Thean, Aaron

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Influence of porosity on dielectric breakdown of ultralow-k dielectrics von Vanstreels, Kris, Ciofi, Ivan, Barbarin, Yohan, Baklanov, Mikhail

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Modeling of Via Resistance for Advanced Technology Nodes von Ciofi, Ivan, Roussel, Philippe J., Saad, Yves, Moroz, Victor, Chia-Ying Hu, Baert, Rogier, Croes, Kristof, Contino, Antonino, Vandersmissen, Kevin, Weimin Gao, Matagne, Philippe, Badaroglu, Mustafa, Wilson, Christopher J., Mocuta, Dan, Tokei, Zsolt

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Integration scheme and 3D RC extractions of three-level supervia at 16 nm half-pitch von Gupta, Anshul, Bömmels, Jürgen, Saad, Yves, Ciofi, Ivan, Wilson, Christopher J.

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System-Level Variation Analysis for Interconnection Networks at Sub-10-nm Technology Nodes Using Multiple Patterning Techniques von Chenyun Pan, Baert, Rogier, Ciofi, Ivan, Tokei, Zsolt, Naeemi, Azad

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Modeling of Edge Scattering in Graphene Interconnects von Contino, Antonino, Ciofi, Ivan, Wu, Xiangyu, Asselberghs, Inge, Celano, Umberto, Wilson, Christopher J, Tokei, Zsolt, Groeseneken, Guido, Soree, Bart

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Modeling of Edge Scattering in Graphene Interconnects von Contino, Antonino, Ciofi, Ivan, Wu, Xiangyu, Asselberghs, Inge, Celano, Umberto, Wilson, Christopher J., Tokei, Zsolt, Groeseneken, Guido, Soree, Bart

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A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers von Goethals, Frederik, Baklanov, Mikhail R, Ciofi, Ivan, Detavernier, Christophe, Van der Voort, Pascal, Van Driessche, Isabel

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Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation von Zahedmanesh, Houman, Gonzalez, Mario, Ciofi, Ivan, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

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Stress analysis of airgaps under process-induced thermo-mechanical loads von Zahedmanesh, Houman, Gonzalez, Mario, Ciofi, Ivan, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

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Towards understanding intrinsic degradation and breakdown mechanisms in SiOCH low-k dielectrics von Wu, Chen, Li, Yunlong, Ciofi, Ivan, Kauerauf, Thomas, Bömmels, Jürgen, De Wolf, Ingrid, Tökei, Zsolt, Croes, Kristof

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Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials von Wu, Chen, Li, Yunlong, Lesniewska, Alicja, Varela Pedreira, Olalla, de Marneffe, Jean-Francois, Ciofi, Ivan, Verdonck, Patrick, Baklanov, Mikhaïl, Boemmels, Juergen, De Wolf, Ingrid, Tokei, Zsolt, Croes, Kristof

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Improved Methodology for Integrated k -Value Extractions von Ciofi, I., Borrello, G., Madia, O., Wilson, C. J., Vereecke, B., Beyer, G. P.

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