Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition von Sabbione, C., Di Cioccio, L., Vandroux, L., Nieto, J.-P., Rieutord, F.

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Surface-emitting microlaser combining two-dimensional photonic crystal membrane and vertical Bragg mirror von Ben Bakir, B., Seassal, Ch, Letartre, X., Viktorovitch, P., Zussy, M., Di Cioccio, L., Fedeli, J. M.

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Low temperature direct bonding: An attractive technique for heterostructures build-up von Moriceau, H., Rieutord, F., Fournel, F., Di Cioccio, L., Moulet, C., Libralesso, L., Gueguen, P., Taibi, R., Deguet, C.

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Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects von Hattori, H.T., Seassal, C., Touraille, E., Rojo-Romeo, P., Letartre, X., Hollinger, G., Viktorovitch, P., Di Cioccio, L., Zussy, M., Melhaoui, L.E., Fedeli, J.M.

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Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy von Martinez, M., Legros, M., Signamarcheix, T., Bally, L., Verrun, S., Di Cioccio, L., Deguet, C.

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Electrically pumped InP-based microdisk lasers integrated with a nanophotonic silicon-on-insulator waveguide circuit von Van Campenhout, J, Rojo Romeo, P, Regreny, P, Seassal, C, Van Thourhout, D, Verstuyft, S, Di Cioccio, L, Fedeli, J-M, Lagahe, C, Baets, R

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Overview of recent direct wafer bonding advances and applications von Moriceau, H, Rieutord, F, Fournel, F, Le Tiec, Y, Di Cioccio, L, Morales, C, Charvet, A M, Deguet, C

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Prevalence of pain in elderly hospitalized patients von Gianni, W, Madaio, R.A, Di Cioccio, L, D’Amico, F, Policicchio, D, Postacchini, D, Franchi, F, Ceci, M, Benincasa, E, Gentili, M, Zuccaro, S.M

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Electrical transport in n -type 4H silicon carbide von Pernot, J., Zawadzki, W., Contreras, S., Robert, J. L., Neyret, E., Di Cioccio, L.

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InP/InGaAs Photodetector on SOI Photonic Circuitry von Binetti, P R A, Leijtens, X J M, de Vries, T, Oei, Y S, Di Cioccio, L, Fedeli, J.-M, Lagahe, C, Van Campenhout, J, Van Thourhout, D, van Veldhoven, P J, Nötzel, R, Smit, M K

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Lattice performance during initial steps of the Smart-Cut™ process in semiconducting diamond: A STEM study von Piñero, J.C., de Vecchy, J., Fernández, D., Alba, G., Widiez, J., Di Cioccio, L., Lloret, F., Araujo, D., Pernot, J.

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Hydrogen implantation-induced blistering in diamond: Toward diamond layer transfer by the Smart Cut™ technique von Masante, C., de Vecchy, J., Mazen, F., Milesi, F., Di Cioccio, L., Pernot, J., Lloret, F., Araujo, D., Pinero, J.C., Rochat, N., Pierre, F., Servant, F., Widiez, J.

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Development of Silicon Photonics Devices Using Microelectronic Tools for the Integration on Top of a CMOS Wafer von Fedeli, J. M., Di Cioccio, L., Marris-Morini, D., Vivien, L., Orobtchouk, R., Rojo-Romeo, P., Seassal, C., Mandorlo, F.

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A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks von Van Campenhout, J., Liu Liu, Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

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Self-alignment of silicon chips on wafers: A capillary approach von Berthier, J., Brakke, K., Grossi, F., Sanchez, L., Di Cioccio, L.

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InP dies transferred onto silicon substrate for optical interconnects application von Kostrzewa, M., Di Cioccio, L., Zussy, M., Roussin, J.C., Fedeli, J.M., Kernevez, N., Regreny, P., Lagahe-Blanchard, Ch, Aspar, B.

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III-V/Si photonics by die-to-wafer bonding von Roelkens, G., Van Campenhout, J., Brouckaert, J., Van Thourhout, D., Baets, R., Romeo, P. Rojo, Regreny, P., Kazmierczak, A., Seassal, C., Letartre, X., Hollinger, G., Fedeli, J.M., Di Cioccio, L., Lagahe-Blanchard, C.

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An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization von Di Cioccio, L., Gueguen, P., Taibi, R., Landru, D., Gaudin, G., Chappaz, C., Rieutord, F., de Crecy, F., Radu, I., Chapelon, L. L., Clavelier, L.

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Stabilization of the tilt motion during capillary self-alignment of rectangular chips von Berthier, J., Brakke, K.A., Mermoz, S., Frétigny, C., Di Cioccio, L.

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InP-Based Membrane Couplers for Optical Interconnects on Si von Binetti, P., Orobtchouk, R., Leijtens, X., Bing Han, de Vries, T., Yoki-Siang Oei, Di Cioccio, L., Fedeli, J.-M., Lagahe, C., van Veldhoven, P.J., Notzel, R., Smit, M.K.

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