Fluid/Structure Interaction Investigation in PBGA Packaging von Ramdan, D., Abdullah, M. Z., ChuYee Khor, Wei Chiat Leong, Wei Keat Loh, Chun Keang Ooi, Renn Chan Ooi

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FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect von Ramdan, D., Abdullah, Z. M., Mujeebu, M. A., Wei Keat Loh, Chun Keang Ooi, Renn Chan Ooi

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Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package von Azmi, Muhammad Afiq, Abdullah, Mohd Zulkifly, Shuib, Raa Khimi, Ariff, Zulkifli Mohamad, Loh, Wei Keat, Ooi, Renn Chan, Ooi, Chun Keang, Abdullah, Muhammad Khalil

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SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD von Ooi, Chun Keang

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Development of Flip Chip Die Bump Temperature Measurement Methodology Using a Computational Fluid Dynamics (CFD) Tool von Ooi, Chun Keang, Bharatham, Logendran, Chiu, Chia-Pin, Chau, David, Gupta, Ashish

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SD-TSOP package thermal design validation and reliability performance evaluation von Chun Keang Ooi, Chia-Pin Chiu, Joo Leong Chan, Tay Tiong We, M.

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