Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy von Chuang, T.H., Lin, H.J., Chi, C.C.

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Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler von CHANG, S. Y, CHUANG, T. H, YANG, C. L

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Role of grain size on the stress corrosion cracking of 7475 aluminum alloys von Tsai, T.C., Chuang, T.H.

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Atomic replacement effects on the band structure of doped perovskite thin films von Cheng, S. L., Du, C. H., Chuang, T. H., Lin, J. G.

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Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals von Tsao, L.C., Chiang, M.J., Lin, W.H., Cheng, M.D., Chuang, T.H.

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Joining 6061 aluminum alloy with Al–Si–Cu filler metals von Chang, S.Y., Tsao, L.C., Li, T.Y., Chuang, T.H.

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Interactions of tandem square cylinders at low Reynolds numbers von Yen, S.C., San, K.C., Chuang, T.H.

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Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer von Yang, C.L., Lai, H.J., Hwang, J.D., Chuang, T.H.

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Progress on superplasticity and superplastic forming in Taiwan during 1987–1997 von Huang, J.C., Chuang, T.H.

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Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal von Chang, S.Y., Chuang, T.H., Tsao, L.C., Yang, C.L., Yang, Z.S.

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Effects of post-weld heat treatments on the residual stress and mechanical properties of electron beam welded SAE 4130 steel plates von HUANG, C. C, PAN, Y. C, CHUANG, T. H

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Cytotoxic 5-Alkylresorcinol Metabolites from the Leaves of Grevillea robusta von Chuang, Ta-Hsien, Wu, Pei-Lin

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Synthesis and electrical characterization of n -type carbon nanowalls von Teii, Kungen, Shimada, Shozaburo, Nakashima, Masahiro, Chuang, Alfred T. H.

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Three-dimensional carbon nanowall structures von Chuang, Alfred T. H., Robertson, John, Boskovic, Bojan O., Koziol, Krzysztof K. K.

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Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers von Chuang, T.H., Lin, H.J.

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Active soldering of ZnS–SiO 2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal von Chang, S.Y., Chuang, T.H., Tsao, L.C., Yang, C.L., Yang, Z.S.

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Freestanding carbon nanowalls by microwave plasma-enhanced chemical vapour deposition von Chuang, Alfred T.H., Boskovic, Bojan O., Robertson, John

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Diffusion bonding/superplastic forming of Ti-6Al-6V-2Sn/SUS 304 stainless steel/Ti-6Al-6V-2Sn von SHYU, J. S, CHUANG, T. H

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Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish von Chuang, T.H., Jain, C.C., Wu, H.M.

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Evaluation of the superplastic formability of SP-Inconel 718 superalloy von YEH, M. S, TSAU, C. W, CHUANG, T. H

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