Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications von Cheng, Chuan-An, Tsai, Tsung-Yen, Huang, Yu-Hsiang, Lin, Chien-Hung, Lee, Chia-Lin, Yang, Shan-Chun, Chen, Kuan-Neng

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Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP Scheme von Cheng, Chuan-An, Huang, Yu-Hsiang, Lin, Chien-Hung, Lee, Chia-Lin, Yang, Shan-Chun, Chen, Kuan-Neng

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2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications von Huang, Po-Tsang, Wu, Shang-Lin, Huang, Yu-Chieh, Chou, Lei-Chun, Huang, Teng-Chieh, Wang, Tang-Hsuan, Lin, Yu-Rou, Cheng, Chuan-An, Shen, Wen-Wei, Chuang, Ching-Te, Chen, Kuan-Neng, Chiou, Jin-Chern, Hwang, Wei, Tong, Ho-Ming

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Detection of air and surface contamination by SARS-CoV-2 in hospital rooms of infected patients von Chia, Po Ying, Coleman, Kristen Kelli, Tan, Yian Kim, Ong, Sean Wei Xiang, Gum, Marcus, Lau, Sok Kiang, Lim, Xiao Fang, Lim, Ai Sim, Sutjipto, Stephanie, Lee, Pei Hua, Son, Than The, Young, Barnaby Edward, Milton, Donald K., Gray, Gregory C., Schuster, Stephan, Barkham, Timothy, De, Partha Pratim, Vasoo, Shawn, Chan, Monica, Ang, Brenda Sze Peng, Tan, Boon Huan, Leo, Yee-Sin, Ng, Oon-Tek, Wong, Michelle Su Yen, Marimuthu, Kalisvar

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Removal of Methylene Blue with Hemicellulose/Clay Hybrid Hydrogels von Cheng, He-li, Feng, Qing-hua, Liao, Chuan-an, Liu, Yu, Wu, Dong-bei, Wang, Qi-gang

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Epidemiological and Clinical Predictors of COVID-19 von Sun, Yinxiaohe, Koh, Vanessa, Marimuthu, Kalisvar, Ng, Oon Tek, Young, Barnaby, Vasoo, Shawn, Chan, Monica, Lee, Vernon J M, De, Partha P, Barkham, Timothy, Lin, Raymond T P, Cook, Alex R, Leo, Yee Sin

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Fever Patterns, Cytokine Profiles, and Outcomes in COVID-19 von Ng, Deborah H L, Choy, Chiaw Yee, Chan, Yi-Hao, Young, Barnaby E, Fong, Siew-Wai, Ng, Lisa F P, Renia, Laurent, Lye, David C, Chia, Po Ying

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Clinical features and predictors of severity in COVID-19 patients with critical illness in Singapore von Puah, Ser Hon, Young, Barnaby Edward, Chia, Po Ying, Ho, Vui Kian, Loh, Jiashen, Gokhale, Roshni Sadashiv, Tan, Seow Yen, Sewa, Duu Wen, Kalimuddin, Shirin, Tan, Chee Keat, Pada, Surinder K. M. S., Cove, Matthew Edward, Chai, Louis Yi Ann, Parthasarathy, Purnima, Ho, Benjamin Choon Heng, Ng, Jensen Jiansheng, Ling, Li Min, Abisheganaden, John A., Lee, Vernon J. M., Tan, Cher Heng, Lin, Raymond T. P., Leo, Yee Sin, Lye, David C., Yeo, Tsin Wen

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Joint estimation of CD4+ cell progression and survival in untreated individuals with HIV-1 infection von Mangal, Tara D

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Wafer-level 3D integration using hybrid bonding von Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen

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The Effect of Sample Site, Illness Duration, and the Presence of Pneumonia on the Detection of SARS-CoV-2 by Real-time Reverse Transcription PCR von Sutjipto, Stephanie, Lee, Pei Hua, Tay, Jun Yang, Mendis, Shehara M, Abdad, Mohammad Yazid, Marimuthu, Kalisvar, Ng, Oon Tek, Cui, Lin, Chan, Monica, Soon, Margaret, Lin, Raymond T P, Leo, Yee-Sin, De, Partha P, Barkham, Timothy, Vasoo, Shawn

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Numerical Simulation of the Effect of Heater Position on the Oxygen Concentration in the CZ Silicon Crystal Growth Process von Teng, Ying-Yang, Chen, Jyh-Chen, Lu, Chung-Wei, Huang, Cheng-Chuan, Wun, Wan-Ting, Chen, Hsueh-I, Chen, Chi-Yung, Lan, Wen-Chieh

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MULTI-LEVEL STACKING OF WAFERS AND CHIPS von Yeh, Sung-Feng, Chen, Cheng-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications von Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-Lung Lin, Ho-Ming Tong

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Through-dielectric vias for direct connection and method forming same von Hu, Chih-Chia, Yeh, Sung-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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Multi-Level Stacking of Wafers and Chips von Yeh, Sung-Feng, Chen, Cheng-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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Multi-level stacking of wafers and chips von Yeh, Sung-Feng, Chen, Cheng-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME von Hu, Chih-Chia, Yeh, Sung-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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MULTI-LEVEL STACKING OF WAFERS AND CHIPS von YEH SUNG FENG, CHEN CHENG FENG, CHENG CHUAN AN, CHEN MING FA

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Through-Dielectric Vias for Direct Connection and Method Forming Same von Hu, Chih-Chia, Yeh, Sung-Feng, Cheng, Chuan-An, Chen, Ming-Fa

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