Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages von Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.

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Shock and vibration protection of submerged jet impingement cooling systems: Theory and experiment von Haji Hosseinloo, Ashkan, Tan, Siow Pin, Yap, Fook Fah, Toh, Kok Chuan

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MEMS-Micropumps: A Review von Nguyen, Nam-Trung, Huang, Xiaoyang, Chuan, Toh Kok

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Thermal Analysis for Underground Data Centres in the Tropics von Jiao, Yanmei, Li, Yuanlong, Wen, Yonggang, Wah Wong, Yew, Chuan Toh, Kok, Cheng Chua, Chee, Ang, Wilson

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3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections von Khan, N., Li Hong Yu, Tan Siow Pin, Soon Wee Ho, Kripesh, V., Pinjala, D., Lau, J. H., Toh Kok Chuan

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Dynamic performance analysis and thermal modelling of a novel two-phase spray cooled rack system for data center cooling von Liu, Pengfei, Kandasamy, Ranjith, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan

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Two-phase spray cooling for high ambient temperature data centers: Evaluation of system performance von Kandasamy, Ranjith, Ho, Jin Yao, Liu, Pengfei, Wong, Teck Neng, Toh, Kok Chuan, Chua, Sunshine Jr

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Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules von Tan, S P, Kok Chuan Toh, Khan, N, Pinjala, D, Kripesh, V

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Thermal resistance of two solids in contact through a cylindrical joint von Tio, Kek-Kiong, Kok Chuan, Toh

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Laminar film condensation inside and outside vertical diverging/converging small channels: A theoretical study von Liu, Pengfei, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan

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Convective filmwise condensation on the outer surface of a vertical tube: A theoretical analysis von Liu, Pengfei, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan

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Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules von Gong Yue Tang, Siow Pin Tan, Khan, N., Pinjala, D., Lau, J.H., Ai Bin Yu, Vaidyanathan, K., Kok Chuan Toh

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Influence of air on heat transfer of a closed-loop spray cooling system von Liu, Pengfei, Kandasamy, Ranjith, Feng, Huicheng, Wong, Teck Neng, Toh, Kok Chuan

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Thermal analysis of micro heat pipes using a porous-medium model von TIO, K.-K, CHANG YU LIU, KOK CHUAN TOH

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Optimization of a Thermoelectric Cooler-Heat Sink Combination for Active Processor Cooling von Hasan, M.H., Kok Chuan Toh

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Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package von Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.

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An adaptable compact thermal model for BGA packages von Ming Xie, Kok Chuan Toh, Pinjala, D.

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Server rack cooling arrangement von Wong, Teck Neng, Ho, Jin Yao, Toh, Kok Chuan, Kandasamy, Ranjith

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MEMS-micropumps: A review : Pump Analysis and Design von NGUYEN, Nam-Trung, XIAOYANG HUANG, TOH KOK CHUAN

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SERVER RACK COOLING ARRANGEMENT von HO, Jin Yao, KANDASAMY, Ranjith, TOH, Kok Chuan, WONG, Teck Neng

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