FAST: An Efficient Flash Translation Layer for Flash Memory von Lee, Sang-Won, Choi, Won-Kyoung, Park, Dong-Joo

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Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys von Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Synthesis and Antiproliferative Activities of 1-Substituted-3-(3-chloro-5-methoxyphenyl)-4-pyridinylpyrazole Derivatives Against Melanoma Cell Line von Won-Kyoung Choi, 오창현

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Design, Synthesis, and Preliminary Cytotoxicity Evaluation of New Diarylureas and Diarylamides Possessing 1,3,4-Triarylpyrazole Scaffold von Choi, Won-Kyoung, El-Gamal, Mohammed I., Choi, Hong-Seok, Hong, Jun-Hee, Baek, Dae-Jin, Choi, Ki-Hang, Oh, Chang-Hyun

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New diarylureas and diarylamides containing 1,3,4-triarylpyrazole scaffold: Synthesis, antiproliferative evaluation against melanoma cell lines, ERK kinase inhibition, and molecula... von Choi, Won-Kyoung, El-Gamal, Mohammed I., Choi, Hong Seok, Baek, Daejin, Oh, Chang-Hyun

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Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization von Da-Quan Yu, Li Ling Yan, Chengkuo Lee, Won Kyoung Choi, Thew, S., Chin Keng Foo, Lau, J.H.

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Comparison of D-[18F]FMAU and L-[18F]FMAU as PET Imaging Agents for HSV1-TK Gene Expression von Byung Seok Moon, Nam Hyun Jo, 이교철, Mohammed I. El-Gamal, Gwang Il An, Su Hee Hong, Tae Hyun Choi, Won-Kyoung Choi, Jin-Hun Park, Jung-Hyuck Cho, 천기정, 오창현

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Synthesis of pyrrolo[2,3- d]pyrimidine derivatives and their antiproliferative activity against melanoma cell line von Jung, Myung-Ho, Kim, Hwan, Choi, Won-Kyoung, El-Gamal, Mohammed I., Park, Jin-Hun, Yoo, Kyung Ho, Sim, Tae Bo, Lee, So Ha, Baek, Daejin, Hah, Jung-Mi, Cho, Jung-Hyuck, Oh, Chang-Hyun

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Radiosynthesis and in vitro evaluation of 1-(tetrahydro-5-hydroxy-6-(hydroxymethyl)-2H-pyran-3-yl)-5-[125I]iodouracil: A new potential agent for HSV1-tk reporter gene monitoring von Jo, Nam Hyun, Kim, Jung Young, El-Gamal, Mohammed I., Choi, Won-Kyoung, Park, Jin-Hun, Kim, Eun Jung, Cho, Jung-Hyuck, Ha, Hyun-Joon, Choi, Tae Hyun, Oh, Chang-Hyun

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Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate von Choi, Won Kyoung, Lee, Hyuck Mo

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Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu von Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung

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Novel amides and esters prodrugs of olmesartan: Synthesis, bioconversion, and pharmacokinetic evaluation von Park, Jin-Hun, Chang, Jeong-Soo, El-Gamal, Mohammed I., Choi, Won-Kyoung, Lee, Woong San, Chung, Hye Jin, Kim, Hyun-Il, Cho, Young-Jin, Lee, Bong Sang, Jeon, Hong-Ryeol, Lee, Yong Sup, Choi, Young Wook, Lee, Jaehwi, Oh, Chang-Hyun

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Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films von Sasangka, Wardhana A., Gan, Chee Lip, Thompson, Carl V., Choi, Won Kyoung, Wei, Jun

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A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu von Yan, Li-ling, Lee, Cheng-kuo, Yu, Da-quan, Yu, Ai-bin, Choi, Won-Kyoung, Lau, John-H, Yoon, Seung-Uk

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Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint von Choi, Won Kyoung, Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo

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Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering von Seo, Sun-Kyoung, Cho, Moon Gi, Lee, Hyuck Mo, Choi, Won Kyoung

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Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate von Choi, Won Kyoung, Lee, Hyuck Mo

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Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate von Choi, Won Kyoung, Lee, Hyuck Mo

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Grain Morphology of Intermetallic Compounds at Solder Joints von Choi, Won Kyoung, Jang, Se-Young, Kim, Jong Hoon, Paik, Kyung-Wook, Lee, Hyuck Mo

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Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders von LAURO, Paul, KANG, Sung K, WON KYOUNG CHOI, SHIH, Da-Yuan

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