Film drainage mechanism between two immiscible droplets von Choi, Se Bin, Lee, Joon Sang

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Rheological behavior of bimodal distribution emulsions on flow adoptability von Park, Jae Yong, Choi, Se Bin, Lee, Joon Sang

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Interfacial behavior of surfactant-covered double emulsion in extensional flow von Lee, Hee Min, Choi, Se Bin, Kim, Jong Hyun, Lee, Joon Sang

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Jamming and unjamming transition of oil-in-water emulsions under continuous temperature change von Choi, Se Bin, Lee, Joon Sang

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Effect of interactions between multiple interfaces on the rheological characteristics of double emulsions von Choi, Se Bin, Park, Jae Yong, Moon, Ji Young, Lee, Joon Sang

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Multi-scale approach for the rheological characteristics of emulsions using molecular dynamics and lattice Boltzmann method von Choi, Se Bin, Yoon, Hong Min, Lee, Joon Sang

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Numerical investigation of the effects of geometric parameters on transverse motion with slanted-groove micro-mixers von Baik, Seung Joo, Cho, Jae Yong, Choi, Se Bin, Lee, Joon Sang

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Numerical simulation of optical control for a soft particle in a microchannel von Moon, Ji Young, Choi, Se Bin, Lee, Jung Shin, Tanner, Roger I, Lee, Joon Sang

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Study for optical manipulation of a surfactant-covered droplet using lattice Boltzmann method von Choi, Se Bin, Kondaraju, Sasidhar, Sang Lee, Joon

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Numerical simulations for the rheological characteristics of emulsions under several conditions including temperature, shear rate, surfactant concentration and droplet size von Choi, Se Bin, Lee, Jung Shin, Baik, Seung Joo, Lee, Joon Sang

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WAFER POLISHING SYSTEM, SIMULATION AND CONTROL METHOD THEREOF von CHOI, Se Bin, KIM, Sung Hyup, SON, Jae Hyeon, KIM, Seok Ryul, WI, Jae-Youn

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Structural Relationships between Variables of Elementary School Students' Intention of Accepting Digital Textbooks von Joo, Young Ju, Joung, Sunyoung, Choi, Se-Bin, Lim, Eugene, Go, Kyung Yi

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Factors Affecting Teenager Cyber Delinquency von Joo, Young Ju, Lim, Kyu Yon, Cho, Sun Yoo, Jung, Bo Kyung, Choi, Se Bin

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Polishing simulation method and polishing simulation system von KIM SEOK RYUL, CHOI SE BIN, KIM SUNG HYUP, SON JAE HYEON, WI JAE YOUN

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SOURCE GAS NOZZLE AND SEMICONDUCTOR WAFER PROCESSING APPARATUS INCLUDING THE SAME von CHOI SE BIN, KIM SUNG HYUP, LEE SANG YUB, AHN TAE HEUNG, HWANG BYEONG HO, PARK JI YE

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Source gas nozzle and semiconductor wafer processing apparatus including the same von PARK, JI-YE, KIM, SUNG-HYUP, AHN, TAE-HEUNG, CHOI, SE-BIN, HWANG, BYEONG-HO, LEE, SANG-YUP

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TEST DEVICE OF HYDRAULIC SYSTEM von CHOI, SE BIN

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SEMICONDUTOR CHIP BONDING APPARATUS INCLUDING A HEAD UNIT HAVING THERMALLY CONDUCTIVE MATERIALS von CHOI SE BIN, LEE JONG GU, LEE SUK WON, KIM SUNG HYUP

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ACTUATOR FOR ACTIVE GEOMETRY CONTROL SUSPENSION SYSTEM von CHOI, SE BIN

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BONDING HEAD DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME von CHOI SE BIN, LEE JONG GU, LEE SANG HOON, KIM BYUNG JO, LEE SUK WON, KIM SUNG HYUP

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