Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

Volltext

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

Volltext

Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging von Eom, Yong‐Sung, Choi, Gwang‐Mun, Jang, Ki‐Seok, Joo, Jiho, Lee, Chan‐mi, Oh, Jin‐Hyuk, Moon, Seok‐Hwan, Choi, Kwang‐Seong

Volltext

Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro‐Light‐Emitting Diodes von Um, Byung Jo, Kweon, Hyungshin, Joo, Jiho, Kang, Seung‐Mo, Kim, Seungwan, Choi, Gwang‐Mun, Lee, Chanmi, Eom, Yong Sung, Choi, Kwang‐Seong, Jang, Junho, Bae, Byeong‐Soo

Volltext

Collective laser‐assisted bonding process for 3D TSV integration with NCP von Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong

Volltext

Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding von Lee, Wan-Geun, Choi, Kwang-Seong, Eom, Yong-Sung, Lee, Jong-Hyun

Volltext

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications von Eom, Yong‐Sung, Jang, Keon‐Soo, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong

Volltext

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding von Le, Xuan-Luc, Le, Xuan-Bach, Hwangbo, Yuhwan, Joo, Jiho, Choi, Gwang-Mun, Eom, Yong-Sung, Choi, Kwang-Seong, Choa, Sung-Hoon

Volltext

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis von Jung, Daniel H., Youngwoo Kim, Kim, Jonghoon J., Heegon Kim, Sumin Choi, Yoon-Ho Song, Hyun-Cheol Bae, Kwang-Seong Choi, Piersanti, Stefano, de Paulis, Francesco, Orlandi, Antonio, Joungho Kim

Volltext

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive von Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae

Volltext

Development and RF characteristics of analog 60-GHz electroabsorption modulator module for RF/optic conversion von Jeha Kim, Jeha Kim, Young-Shik Kang, Young-Shik Kang, Yong-Duck Chung, Yong-Duck Chung, Kwang-Seong Choi, Kwang-Seong Choi

Volltext

Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding von Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung, Bae, Hyun‐Cheol, Lee, Jin Ho

Volltext

Strain-invariant stretchable radio-frequency electronics von Kim, Sun Hong, Basir, Abdul, Avila, Raudel, Lim, Jaeman, Hong, Seong Woo, Choe, Geonoh, Shin, Joo Hwan, Hwang, Jin Hee, Park, Sun Young, Joo, Jiho, Lee, Chanmi, Choi, Jaehoon, Lee, Byunghun, Choi, Kwang-Seong, Jung, Sungmook, Kim, Tae-il, Yoo, Hyoungsuk, Jung, Yei Hwan

Volltext

A 60-GHz-Band Analog Optical System-on-Package Transmitter for Fiber-Radio Communications von Chung, Yong-Duck, Choi, Kwang-Seong, Sim, Jae-Sik, Yu, Hyun-Kyu, Kim, Jeha

Volltext

Fine‐Pitch Solder on Pad Process for Microbump Interconnection von Bae, Hyun‐Cheol, Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung

Volltext

Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life von Eom, Yong‐Sung, Son, Ji‐Hye, Jang, Keon‐Soo, Lee, Hak‐Sun, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Choi, Heung‐Soap

Volltext

Novel Bumping Process for Solder on Pad Technology von Choi, Kwang‐Seong, Bae, Ho‐Eun, Bae, Hyun‐Cheol, Eom, Yong‐Sung

Volltext

Interconnection Technology Based on InSn Solder for Flexible Display Applications von Choi, Kwang‐Seong, Lee, Haksun, Bae, Hyun‐Cheol, Eom, Yong‐Sung, Lee, Jin Ho

Volltext

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications von Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

Volltext

Curing Kinetics and Chemorheological Behavior of No‐flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications von Eom, Yong‐Sung, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Lee, Jin‐Ho

Volltext