An innovative surrogate chip for accurate high-speed wire bond package measurement von Hong Shi, Hoon Ngik Low, Xiaohong Jiang, Ying Fei Tan, Wai Ling Lee, Siow Chek Tan, Swee Fong Chong, Xie, J, Ping Chet Tan, Loon Kwang Tan, Chong Poh Lim, Chiun Ning Liew

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