Cooling a Microprocessor Chip von Mahajan, R., Chia-pin Chiu, Chrysler, G.

Volltext

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities von Mahajan, Ravi, Li, Xiaoqian, Fryman, Joshua, Zhang, Zhichao, Nekkanty, Srikant, Tadayon, Pooya, Jaussi, James, Shumarayev, Sergey, Agrawal, Ankur, Jadhav, Susheel, Singh, Kumar Abhishek, Alduino, Andrew, Gujjula, Sushrutha, Chiu, Chia-Pin, Nordstog, Thomas, Hosseini, Kaveh J., Sane, Sandeep, Deshpande, Nitin, Aygun, Kemal, Sarkar, Arnab, Dobriyal, Priyanka, Pothukuchi, Suresh, Pogue, Vanessa, Hui, David

Volltext

A simple approach for system level thermal transient prediction von Lin, Sheng-Chao, Tsai, Ruey, Chiu, Chia-Pin, Liu, Li-Kang

Volltext

High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates von Wei, Chuang, Qin, Hantang, Ramírez-Iglesias, Nakaira A, Chiu, Chia-Pin, Lee, Yuan-shin, Dong, Jingyan

Volltext

Drop-on-demand E-jet printing of continuous interconnects with AC-pulse modulation on highly insulating substrates von Wei, Chuang, Qin, Hantang, Chiu, Chia-Pin, Lee, Yuan-Shin, Dong, Jingyan

Volltext

Effect of Organic Binder Segregation on Sintered Strength of Dry-Pressed Alumina von Tanaka, Satoshi, Pin, Chiu Chia, Uematsu, Keizo

Volltext

Effect of internal binder on microstructure in compacts made from granules von Tanaka, Satoshi, Chia-Pin, Chiu, Kato, Zenji, Uematsu, Keizo

Volltext

Kinetic nucleation theory : a new expression for the rate of homogeneous nucleation from an ideal supersaturated vapor von GIRSHICK, S. L, CHIA-PIN CHIU

Volltext

Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions von Sung-Won Moon, Prstic, S., Chia-Pin Chiu

Volltext

Characterization of solder interfaces using laser flash metrology von Chiu, Chia-Pin, Maveety, James G, Tran, Quan A

Volltext

Test chip and substrate design for flip chip microelectronic package thermal measurements von Joo Goh, Teck, Chiu, Chia-Pin, Seetharamu, K.N, Quadir, G.A, Zainal, Z.A

Volltext

Density factor approach to representing impact of die power maps on thermal management von Torresola, J., Chia-Pin Chiu, Chrysler, G., Grannes, D., Mahajan, R., Prasher, R., Watwe, A.

Volltext

Thermal management of packages with 3D die stacking von Chia-Pin Chiu, Je-Young Chang, Saha, Sanjoy

Volltext

Critical Aspects of High-Performance Microprocessor Packaging von Atluri, Vasudeva P., Mahajan, Ravi V., Patel, Priyavadan R., Mallik, Debendra, Tang, John, Wakharkar, Vijay S., Chrysler, Gregory M., Chiu, Chia-Pin, Choksi, Gaurang N., Viswanath, Ram S.

Volltext

Calibration of resistance type die level temperature sensors using a single temperature technique von Solbrekken, G.L., Chia-Pin Chiu

Volltext

Two-resistor compact modeling for multiple die and multi-chip packages von Garcia, E.A., Chia-Pin Chiu

Volltext

Thermal Interface Materials von Prasher, Ravi, Chiu, Chia-Pin

Volltext

Numerical study of MgO powder synthesis by thermal plasma von Girshick, S.L., Chiu, Chia-Pin

Volltext

An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications von Chia-Pin Chiu, Biju Chandran, Mello, K., Kelley, K.

Volltext

Examination of thermal test chip designs using an FEA tool von Chia-Pin Chiu

Volltext