Genome-wide analysis of GDSL-type esterases/lipases in Arabidopsis von Lai, Chia-Ping, Huang, Li-Min, Chen, Long-Fang O., Chan, Ming-Tsair, Shaw, Jei-Fu

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Multifunctionality and diversity of GDSL esterase/lipase gene family in rice (Oryza sativa L. japonica) genome: new insights from bioinformatics analysis von Chepyshko, Hanna, Lai, Chia-Ping, Huang, Li-Ming, Liu, Jyung-Hurng, Shaw, Jei-Fu

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Molecular Analyses of the Arabidopsis TUBBY-like Protein Gene Family von Chia-Ping Lai, Chang-Lung Lee, Po-Hsuan Chen, Wu, Shu-Hsing, Chien-Chih Yang, Jei-Fu Shaw

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Arabidopsis SFAR4 is a novel GDSL-type esterase involved in fatty acid degradation and glucose tolerance von Huang, Li-Min, Lai, Chia-Ping, Chen, Long-Fang O., Chan, Ming-Tsair, Shaw, Jei-Fu

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Multi-hop routing mechanism for reliable sensor computing von Chen, Jiann-Liang, Ma, Yi-Wei, Lai, Chia-Ping, Hu, Chia-Cheng, Huang, Yueh-Min

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Functional diversification of the Tubby-like protein gene families (TULPs) during eukaryotic evolution von Lai, Chia-Ping, Chen, Po-Hsuan, Huang, Jen-Pan, Tzeng, Yun-Huei, Chaw, Shu-Miaw, Shaw, Jei-Fu

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Molecular Analyses of the Arabidopsis TUBBY-Like Protein Gene Family1 von Chia-Ping Lai, Chang-Lung, Lee, Chen, Po-Hsuan, Wu, Shu-Hsing

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Transient Fluid Force on an Impulsively Rotated Circular Cylinder in a Uniform Flow von MATSUNAGA, Shigenori, LAI, Chia-Ping, YAMAGA, Fuyume, TSUKAMOTO, Hiroshi

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Routing Mechanism for Reliable Sensor Network Applications von Jiann-Liang Chen, Huan-Wen Tzeng, Chia-Ping Lai

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SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND METHODS OF FORMING THE SAME von Chang, Jen-Yuan, Lai, Chia-Ping

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VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME von CHANG, Jen-Yuan, LAI, Chia-Ping

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Semiconductor Package Including Neighboring Die Contact Seal Ring and Methods for Forming the Same von Chang, Jen-Yuan, Lai, Chia-Ping

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Semiconductor die including fuse structure and methods for forming the same von Chang, Jen-Yuan, Lai, Chia-Ping

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METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE von CHANG, JEN-YUAN, LAI, CHIA-PING

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Vertically Stacked Semiconductor Device Including a Hybrid Bond Contact Junction Circuit and Methods for Forming the Same von Chang, Jen-Yuan, Lai, Chia-Ping

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Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same von Chang, Jen-Yuan, Lai, Chia-Ping

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Semiconductor die and photoelectric device integrated in same package von Chang, Jen-Yuan, Lai, Chia-Ping

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Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same von Chang, Jen-Yuan, Lai, Chia-Ping

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SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME von CHANG, JEN-YUAN, LAI, CHIA-PING

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Vertical semiconductor package including horizontally stacked dies and methods of forming the same von Chang, Jen-Yuan, Lai, Chia-Ping

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