Carbon nanotube thermal pastes for improving thermal contacts von YUNSHENG XU, LEONG, Chia-Ken, CHUNG, D. D. L

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Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink von HOWE, Timothy A, LEONG, Chia-Ken, CHUNG, D. D. L

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Effect of through-thickness compression on the microstructure of carbon fiber polymer-matrix composites, as studied by electrical resistance measurement von Leong, Chia-Ken, Wang, Shoukai, Chung, D. D. L

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Carbon-black thixotropic thermal pastes for improving thermal contacts von LEONG, Chia-Ken, AOYAGI, Yasuhiro, CHUNG, D. D. L

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Carbon black pastes as coatings for improving thermal gap-filling materials von Leong, Chia-Ken, Aoyagi, Yasuhiro, Chung, D.D.L.

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Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance von Leong, Chia-Ken, Chung, D.D.L.

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Improving the electrical and mechanical behavior of electrically conductive paint by partial replacement of silver by carbon black von LEONG, Chia-Ken, CHUNG, D. D. L

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Polyol-based phase-change thermal interface materials von AOYAGI, Yasuhiro, LEONG, Chia-Ken, CHUNG, D. D. L

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Pressure electrical contact improved by carbon black paste von LEONG, Chia-Ken, CHUNG, D. D. L

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Carbon black dispersions and carbon–silver combinations as thermal pastes that surpass commercial silver and ceramic pastes in providing high thermal contact conductance von Leong, Chia-Ken, Chung, D.D.L

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Factors That Govern the Performance of Thermal Interface Materials von Pour Shahid Saeed Abadi, Parisa, Leong, Chia-Ken, Chung, D.D.L.

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The effect of polyimide surface treatment on flip-chip assembly von Ong, M.C., Zhao, X.L., Lim, S.H., Chin, J.M., Chia-Ken Leong, Lim, K., Kuechenmeister, F., Jungnickel, G., Platz, A., Su, M., Syahirah, Z., Dong, Z.L.

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REUSABLE TEMPLATES FOR SEMICONDUCTOR DESIGN AND FABRICATION von LOH, GABRIEL H, KASHEM, ANWAR P, HORT, JOSHUA A, LEONG, CHIA-KEN, BASSO, TODD DAVID, BEKER, BENJAMIN, TU, STEVEN

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REUSABLE TEMPLATES FOR SEMICONDUCTOR DESIGN AND FABRICATION von BEKER, Benjamin, LOH, Gabriel H, LEONG, Chia-ken, HORT, Joshua A, KASHEM, Anwar P, TU, Steven, BASSO, Todd David

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MOLDED CHIP COMBINATION von BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul

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몰딩된 칩 조합물 von BHAGAVAT MILIND S, BARBER IVOR, AGARWAL RAHUL, LEONG CHIA KEN, FU LEI

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MOLDED CHIP COMBINATION von BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul

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Molded chip combination von Fu, Lei, Barber, Ivor, Leong, Chia-Ken, Agarwal, Rahul, Bhagavat, Milind S

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MOLDED CHIP COMBINATION von BHAGAVAT, Milind S, FU, Lei, BARBER, Ivor, LEONG, Chia-Ken, AGARWAL, Rahul

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MOLDED CHIP COMBINATION von Fu, Lei, Barber, Ivor, Leong, Chia-Ken, Agarwal, Rahul, Bhagavat, Milind S

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