Process design for lithium recovery using bipolar membrane electrodialysis system von Hwang, Chi Won, Jeong, Min Ho, Kim, Young Joong, Son, Won Keun, Kang, Kyung Suk, Lee, Chang Soo, Hwang, Taek Sung

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Synthesis and characterization of vinylimidazole-co-trifluoroethylmethacrylate-co-divinylbenzene anion-exchange membrane for all-vanadium redox flow battery von Hwang, Chi Won, Park, Hui-Man, Oh, Chang Min, Hwang, Taek Sung, Shim, Joonmok, Jin, Chang-Soo

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Effect of aminating agents on the permselectivity for nitrate of aminated poly(vinyl benzylchloride-co-styrene-co-hydroxy ethylacrylate) membranes von Park, Hui-Man, Park, Sung-Gyu, Hwang, Chi Won, Hwang, Taek Sung

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Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys von Kim, Young-Sun, Kim, Keun-Soo, Hwang, Chi-Won, Suganuma, Katsuaki

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Synthesis of an aminated poly(vinylidene fluride-g-4-vinyl benzyl chloride) anion exchange membrane for membrane capacitive deionization(MCDI) von Jeong, Kyung Seok, Hwang, Won Chi, Hwang, Taek Sung

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Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders von Hwang, Chi-Won, Suganuma, Katsuaki, Kiso, Masayuki, Hashimoto, Shigeo

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Preparation of poly(GMA-co-PEGDA) microbeads modified with iminodiacetic acid and their indium adsorption properties von Hwang, Chi Won, Kwak, Noh-Seok, Hwang, Taek Sung

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Design of flow through continuous deionization system for indium recovery von Kim, Young Joong, Hwang, Chi Won, Jeong, Min Ho, Hwang, Taek Sung

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Interfaces in lead-free soldering von HWANG, Chi-Won, KIM, Keun-Soo, SUGANUMA, Katsuaki

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Interface microstructure between Fe-42Ni alloy and pure Sn von Hwang, Chi-Won, Suganuma, K., Lee, Jung-Goo, Mori, H.

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Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating von HWANG, Chi-Won, SUGANUMA, Katsuaki, KISO, Masayuki, HASHIMOTO, Shigeo

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The effect of a molecular weight and an amount of PEGDA (poly(ethylene glycol)diacrylate) on a preparation of sodium methallyl sulfonate-co-PEGDA microspheres and sorption behavior... von Kwak, Noh-Seok, Yang, Jeung Ryoul, Hwang, Chi Won, Hwang, Taek Sung

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Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating von HWANG, Chi-Won, LEE, Jung-Goo, SUGANUMA, Katsuaki, MORI, Hirotaro

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Synthesis of a quaternarized poly(vinylimidazole-co-trifluoroethylmethacrylate-co-divinylbenzene) anion-exchange membrane for nitrate removal von Oh, Chang-Min, Hwang, Chi-Won, Hwang, Taek-Sung

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The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging von Kim, Keun-Soo, Suganuma, Katsuaki, Hwang, Chi-Won, Kim, Jong-Min

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Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates von Hwang, Chi-Won, Suganuma, Katsuaki

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A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties von Suh, Daewoong, Hwang, Chi-won, Ueshima, Minoru, Sugimoto, Jun

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Synthesis of Bifunctional Poly(Vinyl Phosphonic Acid-co-glycidyl Metacrylate-co-divinyl Benzene) Cation-Exchange Resin and Its Indium Adsorption von Hwang, Chi Won, Lee, Chang Soo, Hwang, Taek Sung

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A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability von Suh, Daewoong, Hwang, Chi-won, Ueshima, Minoru, Sugimoto, Jun

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Synthesis and properties of sodium vinylbenzene sulfonate-grafted poly(vinylidene fluoride) cation exchange membranes for membrane capacitive deionization process von Kang, Ki Won, Hwang, Chi Won, Hwang, Taek Sung

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