Treffer 1 - 8 von 8 für Suche 'Cheong Choke Fei', Suchdauer: 0,41s Treffer weiter einschränken
  1. 1
    Synthesis and Characterization of Silver Nanoparticles and Silver Inks: Review on the Past and Recent Technology Roadmaps

    Synthesis and Characterization of Silver Nanoparticles and Silver Inks: Review on the Past and Recent Technology Roadmaps von Lai, Chin Yung, Cheong, Choke Fei, Mandeep, Jit Singh, Abdullah, Huda Binti, Amin, Nowshad, Lai, Khin Wee


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  2. 2
    Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package

    Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package von Yung, Lai Chin, Fei, Cheong Choke, Mandeep, Js, Binti Abdullah, Huda, Wee, Lai Khin

    Veröffentlicht in PloS one

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  3. 3
    Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays

    Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays von Yung, Lai Chin, Fei, Cheong Choke, Mandeep, Jit Singh, Amin, Nowshad, Lai, Khin Wee

    Veröffentlicht in Journal of electronic imaging

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  4. 4
    FIB with EDX analysis use for thin film contamination layer inspection

    FIB with EDX analysis use for thin film contamination layer inspection von Lai Chin Yung, Mugunan, Kunjupant, Cheong Choke Fei

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  5. 5
    Temperature cycling and thermal shock correlation in DPAK & DSO packages

    Temperature cycling and thermal shock correlation in DPAK & DSO packages von Lee Chai Ying, Cheong Choke Fei

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  6. 6
    Oxidation on copper lead frame surface which leads to package delamination

    Oxidation on copper lead frame surface which leads to package delamination von Lai Chin Yung, Lee Chai Ying, Cheong Choke Fei, Aw Tiam Ann, Norbert, S.

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  7. 7
    40μm Die Strength Characterization

    40μm Die Strength Characterization von Lem Tien Heng, Cheong Choke Fei, Subaramaniym, S.

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  8. 8
    Stacked wire interconnect technology - Cu wire on Au bump bonding methodology

    Stacked wire interconnect technology - Cu wire on Au bump bonding methodology von San, L.S., Krishna, V., Fei, C.C.

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