Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems von Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Gorecki, Christophe, Jia, Chenping, Frömel, Jörg, Wiemer, Maik

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Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate von Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Guichardaz, Blandine, Herth, Etienne, Gorecki, Christophe, Chenping Jia, Fromel, Jorg, Wiemer, Maik

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IL-9 aggravates the development of atherosclerosis in ApoE-/- mice von Zhang, Wencai, Tang, Tingting, Nie, Daan, Wen, Shuang, Jia, Chenping, Zhu, Zhengfeng, Xia, Ni, Nie, Shaofang, Zhou, Sufeng, Jiao, Jiao, Dong, Wenyong, Lv, Bingjie, Xu, Tongjie, Sun, Bing, Lu, Yuzhi, Li, Yuanyuan, Cheng, Longxian, Liao, Yuhua, Cheng, Xiang

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Wafer-level fabrication of micro Cube-typed beam-splitters by saw-dicing of glass substrates von Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Guichardaz, Blandine, Herth, Etienne, Gorecki, Christophe, Chenping, Jia, Frömel, Jörg, Wiemer, Maik

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IL-9 aggravates the development of atherosclerosis in ApoE-/- mice von Zhang, W., Tang, T., Nie, D., Wen, S., Jia, C., Zhu, Z., Xia, N., Nie, S., Zhou, S., Jiao, J., Dong, W., Lv, B., Xu, T., Sun, B., Lu, Y., Li, Y., Cheng, L., Liao, Y., Cheng, X.

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FEM simulation and its application in MEMS design von Chenping Jia, Reuter, D., Zhiyu Wen, Baum, M., Wiemer, M., Gessner, T.

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Eutectic wafer bonding for 3-D integration von Baum, M, Chenping Jia, Haubold, M, Wiemer, M, Schneider, A, Rank, H, Trautmann, A, Gessner, T

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Developments Trends in the Field of Wafer Bonding Technologies von Wiemer, Maik, Haubold, Marco, Jia, Chenping, Wuensch, Dirk, Froemel, Joerg, Gessner, Thomas

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Mikromechanische Ultraschallwandler aus Silizium = Silicon micromachined ultrasonic transducers

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Developments Trends in the Field of Wafer Bonding Technologies von Wiemer, Maik, Frömel, Jörg, Jia, Chenping, Gessner, Thomas

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Wafer Bonding with BCB and SU-8 for MEMS Packaging von Wiemer, M., Jia, C., Toepper, M., Hauck, K.

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Waferbond technologies and quality assessment von Wiemer, Maik, Fromel, Jorg, Jia, Chenping, Haubold, Marco, Gessner, Thomas

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Monocrystalline silicon wafer crystal orientation calibrating method von LIANGSHENG QU, CHENPING JIA

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Fabrication and characterization of a micro-machined ultrasonic transducer von Chenping Jia, Wiemer, M., Zichner, N., Otto, T., Gessner, T.

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Chair capable of automatically rectifying sitting posture and application method thereof von JIA CHENPING, WU CHENGLIN, YANG SHUAI, LIU PENG, ZHOU SONGPING, TAN DEQUAN, WANG YI, HU WENWU, YANG SHEN, LIU QINGFENG, OUYANG HUARONG

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An adaptive energy-based sequential method for training PINNs to solve gradient flow equations von Guo, Jia, Wang, Haifeng, Hou, Chenping

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Monocrystalline silicon wafer crystal orientation calibrating method von CHENPING,QU JIA

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TCAS-PINN: Physics-informed neural networks with a novel temporal causality-based adaptive sampling method von Guo, Jia, Wang, Haifeng, Gu, Shilin, Hou, Chenping

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Robust auto-weighted multi-view subspace clustering with common subspace representation matrix von Zhuge, Wenzhang, Hou, Chenping, Jiao, Yuanyuan, Yue, Jia, Tao, Hong, Yi, Dongyun

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Facile Engineering of Indomethacin-Induced Paclitaxel Nanocrystal Aggregates as Carrier-Free Nanomedicine with Improved Synergetic Antitumor Activity von Zhang, Chengyuan, Long, Ling, Xiong, Yao, Wang, Chenping, Peng, Cuiping, Yuan, Yuchuan, Liu, Zhirui, Lin, Yongyao, Jia, Yi, Zhou, Xing, Li, Xiaohui

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