Forensic applications of direct analysis in real time (DART) coupled to Q-orbitrap tandem mass spectrometry for the in situ analysis of pigments from paint evidence von Chen, Tai-Hung, Wu, Shu-Pao

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Suppressed humoral immunity is associated with dengue nonstructural protein NS1-elicited anti-death receptor antibody fractions in mice von Tsai, Chung-Lin, Sun, Der-Shan, Su, Mei-Tzu, Lien, Te-Sheng, Chen, Yen-Hsu, Lin, Chun-Yu, Huang, Chung-Hao, King, Chwan-Chuen, Li, Chen-Ru, Chen, Tai-Hung, Chiu, Yu-Hsiang, Lu, Chun-Chi, Chang, Hsin-Hou

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The detection of multiple illicit street drugs in liquid samples by direct analysis in real time (DART) coupled to Q-orbitrap tandem mass spectrometry von Chen, Tai-Hung, Hsu, Hsin-Yun, Wu, Shu-Pao

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Low-Temperature Atmospheric-Pressure-Plasma Jet for Thin-Film Deposition von Huang, C, Hsu, W-T, Liu, C-H, Wu, S-Y, Yang, S-H, Chen, T-H, Wei, T-C

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A role of ygfZ in the Escherichia coli response to plumbagin challenge von Lin, Ching-Nan, Syu, Wan-Jr, Sun, Wei-Sheng W, Chen, Jenn-Wei, Chen, Tai-Hung, Don, Ming-Jaw, Wang, Shao-Hung

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Euphorbiane: A Novel Triterpenoid with an Unprecedented Skeleton from Euphorbia tirucalli von Yu, Hsi-Jung, Shen, Chien-Chang, Yi, Hsiu-Mei, Chen, Tai-Hung, Hsueh, Mao-Lin, Lin, Chu-Chieh, Don, Ming-Jaw

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Low-Temperature Cyclonic Plasma Created at Atmospheric Pressure von Huang, C, Liu, C-H, Wu, S-Y, Chen, T-H, Teng, J-T, Su, C-H, Chen, C-M

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Atmospheric-pressure spin plasma jets processing of polymethylmethacrylate surface using experimental design methodology von Chen, Tai-Hung, Liu, Chi-Hung, Teng, Jyh-tong, Su, Chun-Hsien, Huang, Chun, Sheu, Han-Lin, Lin, Shermann

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New existence theorems of coincidence points approach to generalizations of Mizoguchi-Takahashi’s fixed point theorem von Lin, Ing-Jer, Chen, Tai-Hung

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Insights into the catalytic properties of bamboo vacuolar invertase through mutational analysis of active site residues von Chen, Tai-Hung, Huang, Yu-Chiao, Yang, Chii-Shen, Yang, Chien-Chih, Wang, Ai-Yu, Sung, Hsien-Yi

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Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP von Chau-Jie Zhan, Pei-Jer Tzeng, Lau, J. H., Ming-Ji Dai, Heng-Chieh Chien, Ching-Kuan Lee, Shang-Tsai Wu, Kuo-Shu Kao, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Yu-Min Lin, Jing-Yao Chang, Tsung-Fu Yang, Tai-Hung Chen, Lo, R., Kao, M. J.

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Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections von Shin-Yi Huang, Chau-Jie Zhan, Yu-Wei Huang, Yu-Min Lin, Chia-Wen Fan, Su-Ching Chung, Kuo-Shu Kao, Jing-Yao Chang, Mei-Lun Wu, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen

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SUrface modification for adhesion enhancement of PET/silicone using atmospheric plasma-induced grafting von Tai-Hung Chen, Jyh-tong Teng, Han-Lin Sheu, Chi-Hung Liu, Wen-Tzung Hsieh, Chun-Hsien Su, Shermann Lin

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The development of high through-put micro-bump-bonded process with non-conductive paste (NCP) von Jing-Ye Juang, Su-Tsai Lu, Su-Ching Chung, Su-Mei Cheng, Jong-Shiou Peng, Yu-Lan Lu, Pai-Cheng Chang, Chia-Wen Fan, Chau-Jie Zhan, Tai-Hung Chen

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Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections von Yu-Min Lin, Chau-Jie Zhan, Kuo-Shu Kao, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Shin-Yi Huang, Jing-Yao Chang, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen

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Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration von Ching-Kuan Lee, Chau-Jie Zhan, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Shang-Wei Chen, Shin-Yi Huang, Chia-Wen Fan, Yu-Min Lin, Kuo-Shu Kao, Cheng-Ta Ko, Tai-Hung Chen, Lo, R., Kao, M. J.

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Fine Pitch Compliant Bump Interconnection for Flip chip on Flexible Display Packaging by Anisotropic Conductive Film von Yao-Sheng Lin, Tsung-Fu Yang, Wen-Chi Chen, Tai-Hung Chen, Chun-Cheng Cheng, Yung-Hui Yeh

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27.3: e-Skin IT Device von Chen, M. D., Huang, J. F., Liou, Chang-Ho, Lin, Lieh-Chiu, Chang, Chia-Pao, Chang, Pou-Chi, Chang, Ku-Hsien, Liao, Chi-Chang, Lin, Kang-Hung, Chu, Fang-Tsun, Cheng, Chun-Cheng, Chen, Tai-Hung, Shen, Li-Cheng, Chang, Hsiang-Hung, Chang, Jung-Fang, Pen, I.-Hsuan, Lee, Tzong-Ming, Tyan, Horng-Long, Chang, Chih-Hsiang, Wu, Mao-Sung, Chiang, Pin-Chi Julia, Tsai, Hsiu-Chien

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Universal joint von Chen, Tai Hung

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RATCHET WRENCH von Chen, Tai Hung

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