Optimization of incorporated prebiotics as coating materials for probiotic microencapsulation von Chen, K.N, Chen, M.J, Liu, J.R, Lin, C.W, Chiu, H.Y

Volltext

Semiparametric analysis of transformation models with censored data von Chen, Kani, Jin, Zhezhen, Ying, Zhiliang

Volltext

Optimization on response surface models for the optimal manufacturing conditions of dairy tofu von Chen, Ming-Ju, Kun-Nan Chen, Lin, Chin-Wen

Volltext

Generalized case-cohort sampling von Chen, Kani

Volltext

Local polynomial regression analysis of clustered data von Chen, Kani, Jin, Zhezhen

Volltext

Bonding parameters of blanket copper wafer bonding von CHEN, K. N, FAN, A, TAN, C. S, REIF, R

Volltext

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration von Chen, K N, Tan, C S, Fan, A, Reif, R

Volltext

3D Integration for VLSI Systems von Tan, Chuan Seng, Chen, Kuan-Neng, Koester, Steven J

Volltext

Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology von Chen, K.N., Fan, A., Tan, C.S., Reif, R.

Volltext

Novel A20-gene-eluting stent inhibits carotid artery restenosis in a porcine model von Zhou ZH, Peng J, Meng ZY, Chen L, Huang JL, Huang HQ, Li L, Zeng W, Wei Y, Zhu CH, Chen KN

Volltext

Expression of 11 HOX Genes Is Deregulated in Esophageal Squamous Cell Carcinoma von CHEN, Ke-Neng, GU, Zhen-Dong, YANG KE, LI, Ji-You, SHI, Xiao-Tian, XU, Guang-Wei

Volltext

Microstructure evolution and abnormal grain growth during copper wafer bonding von Chen, K. N., Fan, A., Tan, C. S., Reif, R., Wen, C. Y.

Volltext

Abnormal contact resistance reduction of bonded copper interconnects in three-dimensional integration during current stressing von Chen, K. N., Tan, C. S., Fan, A., Reif, R.

Volltext

p53 codon 72 polymorphism (C/G) and the risk of human papillomavirus‐associated carcinomas in China von Li, Tao, Lu, Zhe‐Ming, Guo, Mei, Wu, Qin‐Jiao, Chen, Ke‐Neng, Xing, Hai‐Ping, Mei, Qiang, Ke, Yang

Volltext

Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application von Tan, C. S., Fan, A., Chen, K. N., Reif, R.

Volltext

Strong Consistency of Maximum Quasi-Likelihood Estimators in Generalized Linear Models with Fixed and Adaptive Designs von Chen, Kani, Hu, Inchi, Ying, Zhiliang

Volltext

Human papillomavirus type 16 is an important infectious factor in the high incidence of esophageal cancer in Anyang area of China von Li, Tao, Lu, Zhe-Ming, Chen, Ke-Neng, Guo, Mei, Xing, Hai-Ping, Mei, Qiang, Yang, Huai-Hua, Lechner, John F., Ke, Yang

Volltext

A cross self-curing system for an aqueous-based PU hybrid von Lai, Jian-Zei, Chen, Pao-Jan, Yeh, Jen-Taut, Chen, Kan-Nan

Volltext

Parametric models for response-biased sampling von Chen, Kani

Volltext

Interfacial morphologies and possible mechanisms of copper wafer bonding von CHEN, K. N, FAN, A, REIF, R

Volltext