Grain Boundary Evolution of Cold-Rolled FePd Alloy during Recrystallization at Disordering Temperature von Lin, Hung-Pin, Chen, Delphic, Kuo, Jui-Chao

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High-Temperature Tempered Martensite Embrittlement in Quenched-and-Tempered Offshore Steels von Yen, Hung-Wei, Chiang, Meng-Hsuan, Lin, Yu-Chen, Chen, Delphic, Huang, Ching-Yuan, Lin, Hsin-Chih

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EBSD characterization of twinned copper using pulsed electrodeposition von Lui, Guan-Tai, Chen, Delphic, Kuo, Jui-Chao

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Post-deposition annealing control of phase and texture for the sputtered MoO3 films von Chang, Wei-Che, Qi, Xiaoding, Kuo, Jui-Chao, Lee, Shih-chin, Ng, Sio-Kei, Chen, Delphic

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Effect of cold deformation on the recrystallization behavior of FePd alloy at the ordering temperature using electron backscatter diffraction von Lin, Hung-Pin, Chen, Yen-Chun, Chen, Delphic, Kuo, Jui-Chao

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Current stressing-induced growth of Cu₃Sn in Cu/Sn/Cu solder joints von Chen, Delphic, Ho, Cheng-En, Kuo, Jui-Chao

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Effect of microscopic parameters on EBSD spatial resolution von Chen, Delphic, Kuo, Jui-Chao, Wu, Wen-Tuan

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Characterization of misorientation gradient of an aluminum bicrystal in simple shear von Chen, Delphic, Kuo, Jui-Chao, Tung, Shih-Heng, Shih, Ming-Hsiang

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Response of Hydrogen Desorption and Hydrogen Embrittlement to Precipitation of Nanometer-Sized Copper in Tempered Martensitic Low-Carbon Steel von Lin, Yu-Chen, Chen, Delphic, Chiang, Meng-Hsuan, Cheng, Guan-Ju, Lin, Hsin-Chih, Yen, Hung-Wei

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Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu von Lin, Han-wen, Lu, Chia-ling, Liu, Chien-min, Chen, Chih, Chen, Delphic, Kuo, Jui-Chao, Tu, K.N.

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Prediction of the orientation spread in an aluminum bicrystal during plane strain compression using a DIC-based Taylor model von Kuo, Jui-Chao, Chen, Delphic, Tung, Shih-Heng, Shih, Ming-Hsiang

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Dynamic behavior of a 6069 Al alloy under hot compression von Zhu, Feng-jun, Wu, Horng-yu, Lee, Shyong, Lin, Ming-chieh, Chen, Delphic

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Characterization of Laves phase in Crofer 22 H stainless steel von Hsiao, Zheng-Wen, Kuhn, Bernd, Chen, Delphic, Singheiser, Lorenz, Kuo, Jui-Chao, Lin, Dong-Yih

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EBSD and electron channeling study of anomalous slip in oligocrystals of high chromium ferritic stainless steel von Hsiao, Zheng-Wen, Wu, Ting-Yi, Chen, Delphic, Kuo, Jui-Chao, Lin, Dong-Yih

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The Effect of Atomic Mass on the Physical Spatial Resolution in EBSD von Chen, Delphic, Kuo, Jui-Chao

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Bilateral filter based orientation smoothing of EBSD data von Chen, Delphic, Kuo, Jui-Chao

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Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu von Lin, Han-wen, Lu, Chia-ling, Liu, Chien-min, Chen, Chih, Chen, Delphic, Kuo, Jui-Chao, Tu, K.N.

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Current stressing-induced growth of Cu 3Sn in Cu/Sn/Cu solder joints von Chen, Delphic, Ho, Cheng-En, Kuo, Jui-Chao

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Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on oriented and nanotwinned Cu von LIN, Han-Wen, LU, Chia-Ling, LIU, Chien-Min, CHEN, Chih, CHEN, Delphic, KUO, Jui-Chao, TU, K. N

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Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper von Lin, Ya Wen, Lui, Kuan Tai, Kuo, Jui Chao, Chen, Delphic

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