Treffer 1 - 9 von 9 für Suche 'Chee-Way Oh', Suchdauer: 0,62s Treffer weiter einschränken
  1. 1
    Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

    Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz von Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu, Chang, E. Y., Zirath, H., Chin-Te Wang, Szu-Ping Tsai, Wee-Chin Lim, Yueh-Chin Lin


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  2. 2
    High frequency flip chip package structure of polymer substrate

    High frequency flip chip package structure of polymer substrate von Chang, Edward-yi, Hsu, Li-Han, Oh, Chee-Way, Wu, Wei-Cheng, Wang, Chin-te

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  3. 3
    High frequency flip chip package process of polymer substrate and structure thereof

    High frequency flip chip package process of polymer substrate and structure thereof von Chang, Edward-yi, Hsu, Li-Han, Oh, Chee-Way, Wu, Wei-Cheng, Wang, Chin-te

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  4. 4
    Electroplated Sn Micro-Bumps for Millimeter-Wave Flip-Chip Packaging

    Electroplated Sn Micro-Bumps for Millimeter-Wave Flip-Chip Packaging von Wang, Chin-Te, Hsu, Li-Han, Wu, Wei-Cheng, Chang, Edward Yi, Way, Oh-Chee


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  5. 5
    High frequency flip chip package structure of polymer substrate

    High frequency flip chip package structure of polymer substrate von WU WEING, CHANG EDWARD-YI, OH CHEE-WAY, WANG CHIN-TE, HSU LI-HAN

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  6. 6
    High frequency flip chip package process of polymer substrate and structure thereof

    High frequency flip chip package process of polymer substrate and structure thereof von WU WEING, CHANG EDWARD-YI, OH CHEE-WAY, WANG CHIN-TE, HSU LI-HAN

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  7. 7
    HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE

    HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE von WU WEING, CHANG EDWARD-YI, OH CHEE-WAY, WANG CHIN-TE, HSU LI-HAN

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  8. 8
    High frequency flip chip package process of polymer substrte and structure thereof

    High frequency flip chip package process of polymer substrte and structure thereof von HSU, LI HAN, WU, WEI CHENG, OH, CHEE-WAY, WANG, CHIN TE, CHANG, EDWARD YI

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  9. 9
    High frequency flip chip package process of polymer substrte and structure thereof

    High frequency flip chip package process of polymer substrte and structure thereof von WU, WEING, OH, CHEE-WAY, WANG, CHIN-TE, CHANG, EDWARD YI, HSU, LI-HAN

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