Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview von Chin, Jiann Min, Narang, Vinod, Zhao, Xiaole, Tay, Meng Yeow, Phoa, Angeline, Ravikumar, Venkat, Ei, Lwin Hnin, Lim, Soon Huat, Teo, Chea Wei, Zulkifli, Syahirah, Ong, Mei Chyn, Tan, Ming Chuan

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Recent advances in fault isolation for semiconductor industry von Jiann Min Chin, Narang, Vinod, Meng Yeow Tay, Shei Lay Phoa, Venkat, Ravikumar, Lwin Hnin Ei, Soon Huat Lim, Chea Wei Teo, Zulkifli, Syahirah, Wen Qiu, Tan, Joseph, Ranganathan, Gopi, Zi Ying Oh, Fang Jie Foo

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Conductive Atomic Force Microscopy failure analysis for SOI devices von Lim Soon-Huat, Zheng Xinhua, Chea-Wei, T., Narang, V., Beng Hock, T., Chin, J.M.

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