Human lactoferrin upregulates BCL-3 in the K562 erythroleukemia cell von Kim, Byungtak, Chang, Ho Gun, Kim, Sun Jung

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Non-Electrolytic Deposition of Silver on Tungsten Powders for Functionally Gradient Composite Powder von Chang, Gun Ho, Lee, Jae Ho

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Via/Hole Filling by Pulse-Reverse Copper Electroplating for 3D SiP von Chang, Gun Ho, Chang, Si Young, Lee, Jae Ho

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Nickel Tungsten Alloy Electroplating for the High Wear Resistant Materials Applications von Ko, Yong Kwon, Chang, Gun Ho, Lee, Jae Ho

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Tamoxifen-resistant breast cancers show less frequent methylation of the estrogen receptor β but not the estrogen receptor α gene von HO GUN CHANG, SUN JUNG KIM, CHUNG, Ki-Wook, NOH, Dong-Young, KWON, Youngmee, EUN SOOK LEE, KANG, Han-Sung

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The Effects of Current Type and Density on Dishing Phenomena in CMP Process von Ko, Yong Jun, Ahn, Yoo Min, Cho, Woong, Lee, Jae Ho, Chang, Gun Ho

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Tamoxifen-resistant breast cancers show less frequent methylation of the estrogen receptor ? but not the estrogen receptor ? gene von Chang, Ho Gun, Kim, Sun Jung, Chung, Ki-Wook, Noh, Dong-Young, Kwon, Youngmee, Lee, Eun Sook, Kang, Han-Sung

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High level expression of the bioactive human interleukin-10 in milk of transgenic mice von Sohn, Bo Hwa, Chang, Ho Gun, Kang, Han-Sung, Yoon, Heesik, Bae, Yun Soo, Lee, Kyung-Kwang, Kim, Sun Jung

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Semiconductor packages von Baek, Seung-Duk, Chang, Gun-Ho

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Semiconductor package von CHANG GUN-HO

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Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same von Chung, Myung-Kee, Chang, Gun-Ho

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SEMICONDUCTOR PACKAGES von BAEK, Seung-Duk, CHANG, Gun-Ho

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METHOD OF DEBONDING A CARRIER SUBSTRATE FROM A DEVICE SUBSTRATE, APPARATUS FOR PERFORMING THE SAME, AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS INCLUDING THE SAME von CHANG, Gun-Ho, CHUNG, Myung-Kee

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Limited CAR for promoting T cell differentiation and application thereof von ZHANG KAI, CHANG GUN-HO

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CD155-targeting CAR structure design and application thereof von ZHANG KAI, CHANG GUN-HO

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Semiconductor chip and semiconductor package including the same von Kim, Kyoung-Soo, Kang, Sun-Won, Song, Ho-Geon, Baek, Seung-Duk, Chang, Gun-Ho

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SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME von Kim, Kyoung-Soo, Kang, Sun-Won, Song, Ho-Geon, Baek, Seung-Duk, Chang, Gun-Ho

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Semiconductor package and method for fabricating the same von Shim, Jong Bo, Chang, Gun Ho, Jo, Cha Je

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SEMICONDUCTOR PACKAGE von NAM GEOL, CHANG GUN HO

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SEMICONDUCTOR PACKAGE von NAMGYAL, CHANG GUN-HO

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