All-electrochemical synthesis of tunable fine-structured nanoporous copper films von Castillo, Ezer, Zhang, Jackson, Dimitrov, Nikolay

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Electrodeposition of Cu-Mn Films as Precursor Alloys for the Synthesis of Nanoporous Cu von Castillo, Ezer, Dimitrov, Nikolay

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Electrodeposition of Zn-rich CuxZn(1−x) Films with Controlled Composition and Morphology von Castillo, Ezer, Dimitrov, Nikolay

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Electrodeposition of Zn-rich Cu x Zn (1−x) Films with Controlled Composition and Morphology von Castillo, Ezer, Dimitrov, Nikolay

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Filling in nanoporous gold with silver via bulk deposition and surface-limited redox replacement approaches von Castillo, Ezer, Xie, Yunxiang, Dimitrov, Nikolay

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Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics von Castillo, Ezer, Njuki, Michael, Pasha, Abdullah Faisal, Dimitrov, Nikolay

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Nanoporous Pd-Cu thin films as highly active and durable catalysts for oxygen reduction in alkaline media von Xie, Yunxiang, Li, Can, Castillo, Ezer, Fang, Jiye, Dimitrov, Nikolay

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Nanoporous Pd-Cu thin films as highly active and durable catalysts for oxygen reduction in alkaline media von Xie, Yunxiang, Li, Can, Castillo, Ezer, Fang, Jiye, Dimitrov, Nikolay

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New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures von Castillo, Ezer, Pasha, Abdullah F, Larson, Zachary I, Dimitrov, Nikolay

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Electrodeposition of Cu-Zn and Cu-Mn Films As Precursors for Nanoporous Copper Synthesis von Castillo, Ezer, Dimitrov, Nikolay

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(Invited) All Electrochemical Synthesis of Nanoporous Cu Films for the Purposes of Fine Pitch and Low Temperature Interconnection in 3D Packaging von Dimitrov, Nikolay, Castillo, Ezer

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Nanoporous Cu-Sn Intermetallic Material for Interconnects in Electronic Packaging von Dimitrov, Nikolay, Castillo, Ezer, Njuki, Michael, Pasha, Abdullah Faisal

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Electrochemical Filling of Nanoporous Gold with Silver via Surface-Limited Redox Replacement von Castillo, Ezer, Xie, Yunxiang, Dimitrov, Nikolay

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