Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA von Dekosky, Jeff, Nair, Deepukumar, Carastro, Larry, Knapp, Scott

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A compact dual band 802.11n front-end module for MIMO applications using multi-layer organic technology von Dalmia, Sidharth, Carastro, Larry, Fathima, Rabia, Govind, Vinu, Dekosky, Jeff, Lapushin, Semyon, Wu, Renbin, Bayruns, Bob, White, George

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A compact single band 802.11 n front-end module for MIMO applications using multi-layer organic technology von Dalmia, S., Fathima, R., Carastro, L., Ghiu, C., White, G.

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Parasitic-Aware RF Design via Parameterization of Embedded Passives on Multilayer Organic Substrates von Sung-Hwan Min, Chung-Seok Seo, Lapushin, S., Carastro, L., Dalmia, S., White, G., Swaminathan, M.

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Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates von Ghiu, C.-D., Dalmia, S., Vickers, J., Carastro, L., Czakon, W., Sundaram, V., White, G.

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Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates von Ghiu, C.-D., Dalmia, S., Vickers, J., Carastro, L., Czakon, W., Sundaram, V., White, G.

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