Corrosion failure analysis about package box of aluminum silicon alloy used for microwave module von Hongwei Li, Qiantao Cao, Zhiming Song

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Failure analysis of TaN thin film resistors for microwave circuits von Qiantao Cao, Zhiming Song, Fei Wang, Bin Wang, Zhenguo Song, Yinglu Hu

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Factors Associated with Thrombolysis Outcome in Ischemic Stroke Patients with Atrial Fibrillation von Zhao, Qiuyun, Li, Xiaobo, Dong, Wanli, Ye, Min, Cao, Yongjun, Zhang, Meijuan, Cheng, Qiantao, Zhou, Junshan, Chen, Guofang, Yu, Ming, Hong, Shanshan, Wei, Xiue, Wang, Bei, Cui, Guiyun, Zhang, Peng, Ding, Hong, Xu, Rongzhen, Chen, Yan, Xu, Yun

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Cold adaptation in pigs depends on UCP3 in beige adipocytes von Lin, Jun, Cao, Chunwei, Tao, Cong, Ye, Rongcai, Dong, Meng, Zheng, Qiantao, Wang, Chao, Jiang, Xiaoxiao, Qin, Guosong, Yan, Changguo, Li, Kui, Speakman, John R, Wang, Yanfang, Jin, Wanzhu, Zhao, Jianguo

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Examination method for transparent medium substrate microstrip circuit wet etching process terminal point von ZHAO HAILUN, CAO QIANTAO, FENG JIANLONG

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Method for preparing high-precision chromium plate mask circuit graphics von ZHAO HAILUN, CAO QIANTAO

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Zero-layer alignment mark structure for photo-etched pattern on medium substrate von CAO QIANTAO

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Alignment mark structure of medium substrate zero layer von CAO QIANTAO

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A 2-bp insertion（c.6768insCC） in MC1R causes recessive white coat color in Bama miniature pigs von Qitao Jia Chunwei Cao Hai Tang Ying Zhang Qiantao Zheng Xiao Wang Rui Zhang Xianlong Wang Ailing Luo Hong Wei Anming Meng Qi Zhou Hongmei Wang Jianguo Zhao

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Thin film process integration method von DONG HANGRONG, ZHAO HAILUN, CAO QIANTAO

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Laser is directly write appearance and is added clamping apparatus von ZHAO HAILUN, CAO QIANTAO, YANG JIAN

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Method for improving microstrip metallized through hole film adhesion von DONG HANGRONG, ZHAO HAILUN, CAO QIANTAO

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Waveguide millimeter wave and terahertz attenuator absorber molding method von DONG HANGRONG, ZHAO HAILUN, CAO QIANTAO

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Method for uniformly thinning inside of dielectric substrate body von DONG HANGRONG, ZHAO HAILUN, CAO QIANTAO

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Pattern electroplating method for microstrip circuit von LONG JIANGHUA, ZHAO HAILUN, CAO QIANTAO

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Method for manufacturing thin film capacitor with anodic oxidation film as dielectric layer von LU BO, CAO QIANTAO, HU YINGLU, SONG ZHENGUO, WANG BIN

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Exposure method of photoresists in thin film circuit plated-through holes and substrate bearing device von LU BO, ZHAO HAILUN, HU YINGLU, CAO QIANTAO, SONG ZHENGUO, ZHAO BINGYU, WANG BIN

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Pattern plating method for integrating two types of sheet resistance film circuits on same plane of dielectric substrate von Cao Qiantao, Sun Jiawen, Zhao Hailun

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Preparation method of terahertz attenuation pieces and attenuation characteristic calibration method of terahertz attenuation pieces von ZHU JUNFENG, CAO QIANTAO, WU BIN, YANG YANZHAO, LIU HONGYUAN, LI JINGSONG, WANG HONGCHAO

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High reflectivity terahertz is speculum now von ZHANG PENG, HAN SHUNLI, CAO QIANTAO

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