Quantification of Triclosan, Chlorinated Triclosan Derivatives, and their Dioxin Photoproducts in Lacustrine Sediment Cores von Anger, Cale T, Sueper, Charles, Blumentritt, Dylan J, McNeill, Kristopher, Engstrom, Daniel R, Arnold, William A

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Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration von Niklaus, F., Kumar, R. J., McMahon, J. J., Yu, J., Lu, J.-Q., Cale, T. S., Gutmann, R. J.

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Classification of Thermal Patterns at Karst Springs and Cave Streams von Luhmann, Andrew J., Covington, Matthew D., Peters, Andrew J., Alexander, Scott C., Anger, Cale T., Green, Jeffrey A., Runkel, Anthony C., Alexander Jr, E. Calvin

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Bench-scale models of dye breakthrough curves von Anger, Cale T., Alexander, E. Calvin

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Feature superfilling in copper electrochemical deposition von SOUKANE, S, SEN, S, CALE, And T. S

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Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach von Bloomfield, M.O., Bentz, D.N., Lu, J.-Q., Gutmann, R.J., Cale, T.S.

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Integrated multiscale process simulation von Cale, T.S., Bloomfield, M.O., Richards, D.F., Jansen, K.E., Gobbert, M.K.

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Substrate-independent sulfur-activated dielectric and barrier-layer surfaces to promote the chemisorption of highly polarizable metallorganics von SENKEVICH, J. J, YANG, G. R, TANG, F, WANG, G. C, LU, T. M, CALE, T. S, JEZEWSKI, C, LANFORD, W. A

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Plasma processes in microelectronic device manufacturing von Rogers, B.R., Cale, T.S.

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Texture and surface roughness of PRCVD aluminum films von YANG, D, JONNALAGADDA, R, ROGERS, B. R, HILLMAN, J. T, FOSTER, R. F, CALE, T. S

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Stress distribution in chemical mechanical polishing von Srinivasa-Murthy, C, Wang, D, Beaudoin, S.P, Bibby, T, Holland, K, Cale, T.S

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Material removal model for chemical–mechanical polishing considering wafer flexibility and edge effects von Seok, Jongwon, Sukam, Cyriaque P., Kim, Andrew T., Tichy, John A., Cale, Timothy S.

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First-principles modeling of electronic transport in π-stacked molecular junctions von Liu, X.-Y., Raynolds, J. E., Wells, C., Welch, J., Cale, T. S.

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Study of the step coverage and contact resistance by using two-step TiN barrier and evolve simulation von Sidhwa, A., Spinner, C., Gandy, T., Goulding, M., Brown, W., Naseem, H., Ulrich, R., Ang, S., Charlton, S., Prasad, V., Cale, T.

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Programmed rate chemical vapor deposition protocols von YANG, D, KRISTOF, J. J, JONNALAGADDA, R, ROGERS, B. R, HILLMAN, J. T, FOSTER, R. F, CALE, T. S

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ABPS as Valid as ABMS von Cale, Robert T

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A multiscale simulator for low pressure chemical vapor deposition von GOBBERT, M. K, MERCHANT, T. P, BORUCKI, L. J, CALE, T. S

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Applications of plasma coatings in artificial joints: an overview von Liang, Hong, Shi, Bing, Fairchild, Aaron, Cale, Timothy

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Effects of carrier film physical properties on W CMP von WANG, D, ZUTSHI, A, BIBBY, T, BEAUDOIN, S. P, CALE, T. S

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Modeling and simulation of plasma enhanced processing for integrated circuit fabrication von Prasad, V., Bloomfield, M.O., Richards, D.F., Liang, H., Cale, T.S.

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